Photosensitive Polysiloxane Resin for Transparent Heat-Resistant Patterning
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Solution Overview
Problem
Conventional encapsulating materials for optical devices, such as epoxy resins, fail to provide sufficient light resistance, heat resistance, and transparency, especially for advanced optical devices like high-output LEDs, and suffer from outgassing and discoloration, limiting their suitability for micro-processing applications.
Innovation Solution
A polysiloxane-based polymer with a silphenylene, isocyanuric acid, and norbornene backbone and an epoxy group in the side chain, combined with a photoacid generator, forms a photosensitive resin composition that enables the creation of a patterned film with high transparency, light resistance, and heat resistance, suitable for advanced optical devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If epoxy resins are used as encapsulating materials, then ease of manufacture is improved, but light resistance and heat resistance deteriorate
Solution Approach 1:
The patent employs a composite material system consisting of a polysiloxane skeleton polymer combined with a silphenylene crosslinker. This composite structure integrates the advantages of both components: the polysiloxane provides flexibility, transparency, and resistance to degradation, while the silphenylene crosslinking network enhances heat resistance, light resistance, and mechanical strength. The synergistic combination resolves the contradiction by achieving high reliability without sacrificing ease of manufacture, as the composite material can be processed using conventional techniques while delivering superior performance for high-output LED encapsulation.
Solution Approach 2:
The patent utilizes parameter changes in the polymer structure, specifically controlling the molecular weight, crosslinking density, and composition ratios of the polysiloxane and silphenylene components. By optimizing these parameters, the material achieves a balance between processability (ease of manufacture) and performance (light and heat resistance). The crosslinking degree and molecular weight are carefully adjusted to ensure the material remains manufacturable while providing the necessary resistance properties for advanced optical devices.
2Ease of manufacture
If epoxy resins are used as encapsulating materials, then ease of manufacture is improved, but heat resistance deteriorates
Solution Approach 1:
The composite material system of polysiloxane polymer and silphenylene crosslinker addresses heat resistance through the silphenylene component's rigid aromatic structure and extensive crosslinking network. This structure provides thermal stability and resistance to thermal degradation, enabling the material to withstand high temperatures associated with high-output LED operation while maintaining ease of manufacture through conventional processing methods.
Solution Approach 2:
The patent optimizes the crosslinking density and molecular weight parameters to enhance heat resistance. By adjusting these parameters, the material achieves a three-dimensional crosslinked network that provides thermal stability without compromising processability. The controlled crosslinking ensures the material can be manufactured using standard techniques while providing the necessary heat resistance for advanced optical devices.
3Ease of manufacture
If conventional epoxy resin materials are used, then ease of manufacture is improved, but transparency deteriorates
Solution Approach 1:
The polysiloxane-silphenylene composite material achieves high transparency through the polysiloxane component's inherent optical clarity and flexibility. The siloxane backbone structure allows for efficient light transmission while the crosslinked network maintains mechanical integrity. This composite approach preserves ease of manufacture while delivering superior transparency compared to conventional epoxy resins, making it suitable for optical devices requiring high light transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polysiloxane polymer and photosensitive resin composition achieve high transparency and light resistance, allowing for fine pattern formation and effective encapsulation of optical devices, addressing the limitations of conventional materials by providing enhanced light and heat resistance.
Implementation Method 1
a photosensitive resin composition comprising (A) the polymer and (B) a photoacid generator
Data Source
AI summary
A polymer comprising polysiloxane, silphenylene, isocyanuric acid, and norbornene skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency, light resistance, and heat resistance.