Polysiloxane Light-Emissive Layers for Solvent-Resistant OLEDs
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Solution Overview
Problem
Current solvent-based roll-to-roll manufacturing processes for OLEDs face challenges in maintaining the integrity of underlying polymer layers due to solvent removal issues, necessitating the development of methods to render solvent-deposited layers insoluble for subsequent deposition steps.
Innovation Solution
Hydrosilation of organometallic compounds with specific ligands and metals, such as Ir, Os, Pt, Pd, or Ru, to create polysiloxanes and hybrid organic-inorganic polymer compositions that result in insoluble light-emissive layers, preventing solvent-induced layer removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solvent-based deposition processes are used to apply multiple polymer layers, then manufacturing cost and scalability are improved, but the solvent used to apply one layer will remove the underlying polymer layer
Solution Approach 1:
The patent applies preliminary action by cross-linking the first polymer layer before applying the second layer. The cross-linking is performed by irradiating the first layer with UV light or exposing it to moisture, which triggers cross-linking reactions that render the layer insoluble before the solvent-based deposition of subsequent layers begins
Solution Approach 2:
The patent changes the solubility parameter of the polymer layer through cross-linking. By introducing cross-linkable functional groups (acrylate, vinyl, epoxide, oxide, isocyanate, carboxyl, amine, hydroxyl) and exposing them to cross-linking conditions, the polymer transitions from a soluble state to an insoluble cross-linked network, preventing solvent removal of underlying layers
2Reliability
If additional layers are added to improve device performance, then device functionality is enhanced, but the problem of solvent removal of underlying layers is exacerbated
Solution Approach 1:
The patent systematically applies preliminary cross-linking action to each layer before depositing subsequent layers. This enables the construction of multi-layer devices with improved performance while maintaining layer integrity through sequential cross-linking and deposition steps
Solution Approach 2:
The patent employs composite material strategies by combining polymer layers with cross-linkable functional groups and cross-linking agents. This creates a composite structure where cross-linked layers provide structural stability while allowing subsequent solvent-based depositions of functional layers for enhanced device performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting polysiloxanes and polymer compositions ensure the stability of solvent-deposited layers, enabling the formation of multi-layer OLEDs without layer removal, thus improving the manufacturing process for large-volume, low-cost general lighting applications.
Implementation Method 1
Hydrosilation of an organometallic compound of formula L2MZ can result in light emissive layers that are insoluble
Implementation Method 2
polysiloxanes derived from hydrosilation of an electrophorescent organometallic compound of formula L2MZ
Implementation Method 3
hybrid organic-inorganic polymer compositions through reactions between hydrosiloxanes and polyfluorenes
Data Source
AI summary
Optoelectronic devices include polysiloxanes derived from hydrosilation of an organometallic compound of formula L2MZ,whereinL and Z are independently bidentate ligands;at least one of L and Z comprises alkenyl, alkenylaryl, alkenyloxy, alkenyloxyaryl, alkynyl, alkynylaryl, alkynyloxy, alkynyloxyaryl, substituted alkenyl, substituted alkenylaryl, substituted alkenyloxy, substituted alkenyloxyaryl, substituted alkynyl, substituted alkynylaryl, substituted alkynyloxy, substituted alkynyloxyaryl, acrylate, methacrylate, or a combination thereof; andM is Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Ga, Ge, In, Sn, Sb, Tl, Pd, Bi, Po, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, or Lu.