Polysilsesquioxane Optical Device Securing Material
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Solution Overview
Problem
Current optical device-securing materials with polysilsesquioxane compounds fail to produce cured products that exhibit sufficient heat resistance and delamination resistance while maintaining adhesion, leading to potential cracks and delamination issues due to high-energy light and high-temperature exposure.
Innovation Solution
A curable polysilsesquioxane compound with specific 29Si nuclear magnetic resonance spectrum characteristics, including a first peak top within −60 to −54 ppm and a second peak top within −70 to −61 ppm, and a mass average molecular weight of 1,000 to 50,000, which is produced through polycondensation using an acid catalyst and further processed with an organic solvent and base, is used in a curable composition with a silane coupling agent to achieve high adhesion, heat resistance, and delamination resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a polysilsesquioxane compound is used as the main component in an optical device-securing composition, then adhesion is improved, but heat resistance and delamination resistance deteriorate under high-temperature exposure
Solution Approach 1:
The invention changes the chemical structure parameters of the polysilsesquioxane compound by specifying that R contains no carbonyl group and defining the molecular weight range (1,000 to 50,000). This parameter optimization resolves the contradiction by eliminating the carbonyl group that causes degradation under high-temperature exposure, thereby maintaining both adhesion and heat resistance
Solution Approach 2:
The invention creates a composite material system by combining the optimized polysilsesquioxane compound with specific curing agents and silane coupling agents. This composite approach allows the material to exhibit both strong adhesion properties and excellent heat resistance, resolving the contradiction between these two properties
2Reliability
If the polysilsesquioxane compound is exposed to high-energy light and high-temperature heat from optical devices, then the material may deteriorate over time, but maintaining adhesion while improving heat resistance is difficult
Solution Approach 1:
The invention optimizes the molecular weight parameter to be within 1,000 to 50,000 and eliminates carbonyl groups from the structure. These parameter changes enable the material to resist degradation from high-energy light and heat while maintaining adhesion strength
Solution Approach 2:
The invention introduces silane coupling agents as intermediaries that bridge the polysilsesquioxane compound and the substrate. These coupling agents protect the adhesion interface from thermal degradation while maintaining strong bonding, thus resolving the contradiction between heat resistance and adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting cured product exhibits high adhesion and resistance to high-energy light and high temperatures, effectively preventing cracks and delamination, making it suitable for use as an optical device-securing material.
Implementation Method 1
a 29Si nuclear magnetic resonance spectrum in which a first peak top is within a range of −60 ppm or more and less than −54 ppm, a second peak top is within a range of −70 ppm or more and less than −61 ppm
Implementation Method 2
subjecting one compound or two or more compounds represented by the following formula (1) to polycondensation in the presence of a polycondensation catalyst
Data Source
AI summary
The present invention is a curable polysilsesquioxane compound comprising one structural unit or two or more structural units represented by R1SiO3/2, the curable polysilsesquioxane compound having a 29Si nuclear magnetic resonance spectrum that has a first peak top within a range of −60 ppm or more and less than −54 ppm, has a second peak top within a range of −70 ppm or more and less than −61 ppm, and substantially does not have a peak within a range of −53 ppm or more and less than −45 ppm, anda method for producing the curable polysilsesquioxane compound, anda curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, anda cured product obtained by heating the curable composition, anda method for using the curable polysilsesquioxane compound or the curable composition, as an optical device-securing material.