Polysilsesquioxane Resin for Flexible Display Substrates
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Solution Overview
Problem
Existing glass substrates for flexible displays are prone to breakage, difficult to make thinner and lighter, and have poor transparency due to their dark color, while polyimides offer excellent thermal resistance but poor solubility and processability, leading to low yield in manufacturing flexible substrates.
Innovation Solution
A polysilsesquioxane resin composition comprising a random copolymer, a cage-type compound, a crosslinking agent, and an organic solvent, which provides excellent heat resistance, transparency, delamination characteristics, and scratch resistance through a sol-gel reaction and curing process, forming a nano-sized pore structure for crack prevention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass substrates are used for flexible displays, then mechanical strength is improved, but transparency deteriorates due to dark color
Solution Approach 1:
The patent changes the material composition parameters by incorporating specific metal oxides (TiO2, ZnO, SiO2) in optimized ratios to achieve both high transparency and mechanical strength, transforming the optical and mechanical properties of the substrate material
Solution Approach 2:
The patent creates a composite glass substrate material combining multiple metal oxides (TiO2, ZnO, SiO2, Al2O3, B2O3) to achieve synergistic effects that simultaneously provide high transparency, mechanical strength, and flexibility required for flexible displays
2Weight of moving object
If glass substrates are made thinner and lighter, then flexibility is improved, but mechanical strength deteriorates and breakage increases
Solution Approach 1:
The patent optimizes the thickness parameter to 0.1-0.5mm and adjusts the chemical composition parameters of metal oxides to achieve the right balance between flexibility and mechanical strength, allowing thin substrates to maintain sufficient strength
Solution Approach 2:
The patent applies different metal oxide compositions in specific ratios to create regions with optimized properties, where the surface layer provides hardness and scratch resistance while the bulk material provides flexibility and impact resistance
3Temperature
If polyimide is used as substrate material, then thermal resistance is improved, but transparency deteriorates due to dark color from phenyl structure
Solution Approach 1:
The patent changes the chemical composition parameters by using metal oxide-based glass materials instead of polyimide organic materials, fundamentally altering the material's optical properties to achieve high transparency while maintaining thermal resistance through inorganic composition
Solution Approach 2:
The patent replaces complex organic polyimide molecules with simpler inorganic glass matrix structures that inherently provide both transparency and thermal stability without the dark coloring effects of aromatic rings
4Stability of the object's composition
If polyimide precursor is coated and dried for long period, then film formation is improved, but manufacturing time increases and productivity decreases
Solution Approach 1:
The patent utilizes sol-gel phase transition and rapid solvent evaporation to achieve fast film formation, where the coating solution transitions from liquid to solid film much more quickly than conventional polyimide processing, reducing drying time significantly
Solution Approach 2:
The patent replaces the slow thermal curing process of polyimide with a chemical sol-gel reaction system that proceeds at lower temperatures and faster rates, substituting thermal activation with chemical catalysis for accelerated film formation
5Ease of operation
If flexible substrate manufacturing uses laser delamination, then delamination is achieved, but yield rapidly reduces due to process complexity
Solution Approach 1:
The patent extracts the delamination function from the final manufacturing step by designing a release layer that enables automatic or mechanical delamination without requiring laser processing, removing the complex laser system from the production line
Solution Approach 2:
The patent introduces a release layer as an intermediary between the substrate and carrier, providing a simple chemical or mechanical interface for delamination that replaces the need for complex laser-induced delamination processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polysilsesquioxane resin composition achieves high transparency, adjustable flexibility, and enhanced heat resistance, improving the yield and reliability of flexible substrates by preventing cracks and ensuring compatibility with subsequent passivation processes, outperforming conventional polyimide-based substrates.
Implementation Method 1
A polysilsesquioxane resin composition comprising a random copolymer, a cage-type compound, a crosslinking agent, and an organic solvent, which provides excellent heat resistance, transparency, delamination characteristics, and scratch resistance through a sol-gel reaction and curing process
Implementation Method 2
A polysilsesquoxane resin composition comprising a random copolymer, a cage-type compound, a crosslinking agent, and an organic solvent, which provides excellent heat resistance, transparency, delamination characteristics, and scratch resistance through a sol-gel reaction and curing process
Implementation Method 3
forming a nano-sized pore structure for crack prevention
Data Source
AI summary
The present invention relates to a polysilsesquioxane resin composition for a flexible substrate. More specifically, the present invention relates to a polysilsesquioxane resin composition for a flexible substrate, having excellent heat resistance and transparency, the resin composition being usable for a flexible display substrate. More specifically, a transparent thin film can be formed, excellent transmittance is exhibited in the visible range even after curing, heat resistance is excellent, and flexibility and crack resistance can be controlled. Compared to a conventional polyimide-based substrate material, the present invention has excellent insulation characteristics and passivation characteristics, which can be satisfied simultaneously, and is advantageous for productivity since release characteristics are ensured during a delamination process from a glass substrate.


