Polysulfone-Polyamide Laminate Sheet for Heat Resistance and Tracking
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Solution Overview
Problem
Existing electrically insulating resin compositions and laminate sheets face challenges in achieving both excellent heat resistance and tracking resistance, with conventional materials often compromising on mechanical properties or interlayer peel suppression.
Innovation Solution
A polysulfone resin with sulfonyl groups and a polyamide resin, where the polyamide resin constitutes 1-45% by mass, is used to form an electrically insulating resin composition, which can be molded into a sheet-like shape, providing enhanced tracking resistance and heat resistance. The laminate sheet incorporates this resin composition between sheet materials, with wholly aromatic polyamide papers and corona-treated surfaces to further improve heat resistance and interlayer adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyphenylene sulfide resin and vinyl copolymer are used for electrical insulation, then tracking resistance is improved, but heat resistance deteriorates due to reduced tensile strength under heat
Solution Approach 1:
The patent changes the chemical composition parameters by replacing polyphenylene sulfide resin with polysulfone resin (including polyether sulfone or polyphenylsulfone), which has inherently higher heat resistance while maintaining electrical insulation properties. This parameter change in resin chemistry resolves the contradiction between tracking resistance and heat resistance
Solution Approach 2:
The patent creates a composite material system by combining polysulfone resin with polyamide resin (1-45% by mass) and incorporating adhesive promoters. This composite approach synergistically combines the high heat resistance of polysulfone with the adhesive properties of polyamide, achieving both heat resistance and tracking resistance simultaneously
2Reliability
If sheet materials are bonded with electrically insulating resin composition, then interlayer peel is suppressed through adhesiveness, but heat resistance deteriorates due to mechanical property reduction under heat
Solution Approach 1:
The patent changes the resin composition parameters by using polysulfone resin as the base material instead of conventional resins, which provides inherent heat resistance. The composition parameters are further optimized by controlling polyamide resin content at 1-45% by mass and adding specific adhesive promoters, achieving both strong adhesion and heat resistance
Solution Approach 2:
The patent develops a composite resin composition combining polysulfone resin with polyamide resin and adhesive promoters. This composite material simultaneously provides the heat resistance from polysulfone and the adhesion properties from polyamide and adhesive promoters, resolving the contradiction between interlayer peel suppression and heat resistance
Data Source
AI summary
The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass.