Hydrolyzable Polyurethane Polishing Layer for CMP Pad Affinity Control

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Solution Overview

Problem

Existing polishing pads for chemical mechanical polishing (CMP) do not adequately address the need for high polishing rate and planarization performance, particularly in semiconductor manufacturing, and lack flexibility in adjusting surface properties to optimize affinity with abrasive grains and slurry conditions.

Innovation Solution

A polyurethane with a carboxylic acid ester group is used in the polishing layer, which can be hydrolyzed to introduce carboxyl groups, allowing adjustment of zeta potential and hydrophilicity, enhancing the affinity for abrasive grains and improving polishing performance across various slurry conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional polyurethane materials are used in polishing layers, then basic polishing function is provided, but polishing rate and planarization performance are insufficient for high integration circuits

Engineering Contradiction:

Improvepolishing rateVSAvoidplanarization performance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The invention changes the chemical composition parameters of the polyurethane by introducing carboxylic acid groups through reaction with carboxylic acid compounds. This chemical modification alters the surface properties and zeta potential of the polishing layer, enabling higher polishing rates and better planarization performance required for high integration circuits while maintaining material reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite polyurethane material by combining conventional polyurethane with carboxylic acid compounds. This composite structure integrates the mechanical properties of polyurethane with the surface activity of carboxylic acid groups, achieving both high productivity in polishing and reliable planarization performance

Inventive Principle:

Principle #40Composite materials

2Productivity

If polishing surface affinity with abrasive grains is increased to improve polishing rate, then break-in time is reduced, but control over surface properties becomes limited

Engineering Contradiction:

Improvebreak-in timeVSAvoidsurface property adjustment flexibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The invention enables flexible adjustment of surface properties by controlling the type and amount of carboxylic acid compounds used in the polyurethane synthesis. By varying these parameters, the zeta potential and surface affinity can be optimized for different slurry conditions and abrasive grains, achieving rapid break-in while maintaining adaptability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention introduces carboxylic acid groups specifically at the polishing surface region through controlled chemical reaction. This local modification enhances surface affinity and reduces break-in time without compromising the bulk material properties, providing flexible surface property adjustment while maintaining overall material integrity

Inventive Principle:

Principle #3Local quality

3Productivity

If zeta potential is adjusted to enhance affinity with abrasive grains, then polishing rate improves, but adhesion of polishing debris to surface increases causing scratches

Engineering Contradiction:

Improvepolishing rateVSAvoidsurface scratches and defects

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The invention optimizes the zeta potential parameter within a specific range by controlling carboxylic acid compound concentration and molecular weight. This parameter optimization achieves sufficient affinity with abrasive grains for high polishing rate while preventing excessive adhesion that would cause debris accumulation and surface defects

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses carboxylic acid compounds with specific molecular structures that replicate the desired surface properties. By selecting appropriate carboxylic acid compounds, the polishing surface achieves optimal electrostatic characteristics that promote abrasive grain affinity while minimizing harmful debris adhesion

Inventive Principle:

Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modified polyurethane polishing layer achieves high polishing rate and stability, with improved affinity for abrasive grains in both acidic and alkaline slurries, reducing scratches and defects on the polished surface.

Implementation Method 1

a carboxylic acid ester group, which produces a carboxyl group by being hydrolyzed

Methodology Applied

Scientific EffectHydrolysis: Hydrolysis

Data Source

PatentUS20250236766A1Polyurethane for use in polishing layer, polishing layer, polishing pad, and method for modifying polishing layer

Publication Date: 2025.07.24 KURARAY CO LTD

AI summary

Disclosed is a polyurethane for use in a polishing layer, including a carboxylic acid ester group, and a polyurethane preferably having a carboxylic acid ester group in at least one of a side chain, a main chain terminal, and a main chain skeleton is preferably used. Also disclosed is a method for modifying a polishing layer, including the steps of: preparing a polishing layer including a polyurethane having a carboxylic acid ester group; and hydrolyzing the carboxylic acid ester group of the polyurethane, to produce a carboxyl group.