Polyurethane Curable Resin Composition for Low-Adhesion Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation materials face challenges in achieving low adhesion force while maintaining high thermal conductivity, often requiring expensive silicone resins and plasticizers that can cause contact failure and elution issues.
Innovation Solution
A curable resin composition, particularly a polyurethane-based composition, is developed to exhibit low adhesion force without using plasticizers, utilizing oil-modified polyol compounds to adjust adhesion properties, while maintaining high thermal conductivity and other desirable properties like thermal conductivity, hardness, flexibility, and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If silicone resin is used as the resin binder to achieve low adhesion force, then adhesion force is reduced, but cost increases and reliability decreases due to contact failure and limited uses
Solution Approach 1:
The patent changes the chemical composition parameters of the resin binder from conventional silicone resin to a specific polyurethane-based composition containing polyester polyol and polyether polyol in controlled ratios. This parameter change achieves low adhesion force while eliminating the contact failure and reliability issues associated with silicone resin
Solution Approach 2:
The patent uses a composite resin binder system combining polyester polyol and polyether polyol with specific molecular weight ranges and hydroxyl values. This composite material approach provides both low adhesion force and high reliability, avoiding the drawbacks of single-component silicone resin
2Temperature
If polyurethane material is used to achieve high thermal conductivity, then thermal conductivity is improved, but adhesion force becomes excessively high to most adherends
Solution Approach 1:
The patent modifies the polyurethane composition by controlling the ratio of polyester polyol to polyether polyol, the molecular weights, and the hydroxyl values. These parameter changes reduce the adhesion force of polyurethane from its conventional high level to a controlled low level while preserving high thermal conductivity
Solution Approach 2:
The patent creates local quality differences in the resin binder by incorporating specific components (polyester polyol with 40-80% content providing thermal conductivity, polyether polyol providing flexibility and controlled adhesion) in defined proportions, achieving both high thermal conductivity and low adhesion force in the same material
3Force
If plasticizer is blended in large amount to control adhesion force, then adhesion force is reduced, but the inherent merits of the material are damaged and elution occurs during use
Solution Approach 1:
The patent extracts the adhesion control function from separate plasticizer additives and integrates it into the fundamental resin binder composition through the polyester-polyether polyol system. This eliminates the need for additional plasticizers that cause elution and material degradation
Solution Approach 2:
The resin binder composition itself provides adhesion control through its inherent molecular structure and composition ratios, without requiring external plasticizer additives. The polyester polyol and polyether polyol work together to self-regulate adhesion force while maintaining material integrity and preventing elution
Data Source
AI summary
The present application relates to a resin composition or a use thereof. In the present application, it is possible to provide a resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The present application can also provide a product comprising the curable composition or the cured body thereof.