Polyurethane Mounting Pad Low Pressure Compressibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing polyurethane mounting pads with high compressibility and compression recovery rates, as per JIS standards, fail to achieve uniform and precise polishing at low pressure conditions, leading to defective polishing during the processing of glass substrates for display devices.
Innovation Solution
A polyurethane mounting pad with Low P compressibility of 1 to 10% and Low P compression length of 15 to 100 µm, achieved through an immersion process in an aqueous solution and heat treatment, allowing for sufficient compression under practical polishing pressures and uniform force distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a mounting pad with high compressibility and compression recovery rate is used according to JIS standards, then the compressibility is improved, but the polishing uniformity and precision deteriorate under low pressure conditions
Solution Approach 1:
The patent changes the measurement parameter from standard JIS compressibility (100g/cm²) to low-pressure compressibility (5g/cm²) to better reflect actual polishing conditions. It also introduces compression length as a new parameter to quantify the pad's deformation under practical loads, enabling optimization of polishing performance rather than just meeting standard specifications.
Solution Approach 2:
The patent replaces the traditional mechanical compression test with a low-pressure immersion process that simulates actual polishing conditions. This substitution allows the pad to be evaluated and treated under the same mechanical conditions it will experience during polishing, revealing performance characteristics that standard high-pressure tests miss.
2Stability of the object's composition
If the mounting pad is treated through immersion process and heat treatment to improve compressibility, then the compression recovery rate is improved, but the process complexity increases
Solution Approach 1:
The patent applies preliminary treatment steps (immersion in aqueous solution, heat treatment) before the actual polishing process. These pre-treatments prepare the mounting pad in advance to achieve optimal compressibility and compression recovery rate, ensuring that the pad is already in the desired state when polishing begins, rather than adjusting during the process.
Solution Approach 2:
The patent utilizes phase transition through heat treatment to alter the physical properties of the mounting pad. By controlling temperature changes during the treatment process, the pad's molecular structure is reconfigured to achieve better compressibility and elastic recovery, leveraging thermal energy to transform the material's properties.
3Stress or pressure
If the mounting pad compresses sufficiently under low pressure, then the force distribution is improved, but the compression length increases
Solution Approach 1:
The patent optimizes the compression length parameter by controlling the low-pressure treatment conditions. By carefully managing the immersion time, temperature, and pressure levels during the treatment process, the pad achieves the optimal balance where sufficient compression occurs for uniform force distribution without excessive compression length that would compromise structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables more uniform and high-efficiency polishing, reducing the defective polishing rate by ensuring even force distribution and impact absorption during the polishing of glass substrates at low pressure conditions.
Implementation Method 1
a mounting pad having excellent compressibility and compression length under low pressure
Implementation Method 2
excellent elastic power under practical polishing conditions
Data Source
Figure 1~2
Figure 3~4
AI summary
This disclosure relates to a polyurethane mounting pad having Low P compressibility of 1 to 10%, the Low P compressibility being the ratio of the difference between a first thickness and a second thickness to the first thickness, the first thickness being measured by applying a pressure of 5g/cm2 to a thickness direction of the mounting pad, and the second thickness being measured by applying a pressure of 100g/cm2 to a thickness direction of the mounting pad, wherein Low P compression length, which is the difference between the first thickness and the second thickness, is 15 to 100 µm. According to the present invention, provided is a polyurethane mounting pad that has high compressibility and excellent elastic power under practical polishing conditions, and can realize more uniform and high efficiency polishing to decrease defective polishing rate.