Thermosetting Polyurethane Release Film for Semiconductor Packaging
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Solution Overview
Problem
Conventional release films for semiconductor packaging, typically made of ETFE, fail to withstand high temperatures and pressures during the molding process, leading to rupture and contamination issues, which decrease productivity due to frequent mold cleaning requirements.
Innovation Solution
A release film comprising a first and second polyurethane layer portion with fine unevenness, thermosetting polyurethane cross-linkage, and an optional intermediate adhesive layer, designed to withstand high temperatures and pressures while minimizing fume-gas permeability and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ETFE release film is used for semiconductor packaging, then the film can be manufactured using conventional extrusion methods, but the film cannot withstand high temperature and pressure conditions during molding, leading to rupture and edge portion failure
Solution Approach 1:
The patent changes the fundamental material parameter from thermoplastic ETFE to thermosetting polyurethane resin. This material substitution enables the release film to withstand high temperature and pressure conditions during semiconductor molding while maintaining manufacturability through coating and curing processes. The thermosetting nature provides cross-linked molecular structure that resists deformation and rupture under molding conditions.
Solution Approach 2:
The patent employs composite material structure by combining polyurethane resin with inorganic fillers and additives. This composite approach enhances the mechanical strength, thermal stability, and release properties of the film, allowing it to withstand high temperature and pressure while maintaining manufacturability through proven coating technologies.
2Ease of manufacture
If ETFE release film is used during EMC molding, then the film can be easily manufactured and applied, but fume-gas generated from EMC has high permeability through the film, causing mold contamination
Solution Approach 1:
The patent changes the material composition parameter from ETFE to polyurethane resin, which fundamentally alters the permeability characteristics. The polyurethane matrix with cross-linked structure and inorganic filler additions creates a denser, less permeable barrier that effectively blocks fume-gas generated during EMC molding, preventing mold contamination while maintaining ease of manufacture through coating processes.
Solution Approach 2:
The release film is designed as a disposable consumable item that is discarded after a single use. By optimizing the material composition for low permeability and high reliability, the film prevents mold contamination without requiring expensive mold cleaning and maintenance, improving overall productivity despite the film being single-use.
3Adaptability or versatility
If ETFE release film is used at high temperature conditions, then the film can be applied in molding processes, but the thermoplastic properties cause the film to rupture and decrease productivity
Solution Approach 1:
The patent changes the thermal property parameter by substituting thermoplastic ETFE with thermosetting polyurethane resin. This fundamental material parameter change enables the film to maintain structural integrity at high molding temperatures without rupture. The cross-linked thermosetting structure prevents melting and deformation, allowing the film to withstand typical semiconductor molding temperature ranges while maintaining high productivity through elimination of rupture-related defects.
4Device complexity
If conventional release films are used, then the manufacturing process is simple, but frequent mold cleaning is required due to contamination, decreasing productivity
Solution Approach 1:
The patent changes the material composition parameter to polyurethane resin with specific permeability characteristics that block fume-gas. This parameter change reduces mold contamination to minimal levels, eliminating the need for frequent mold cleaning operations. While the coating and curing process adds some complexity compared to simple extrusion, the dramatic reduction in mold maintenance requirements significantly improves overall production efficiency and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film maintains mechanical integrity and releasability under high temperature and pressure conditions, reducing mold contamination and improving productivity by preventing rupture and fume-gas permeability, thus enhancing the quality and yield of semiconductor packages.
Implementation Method 1
the first and second polyurethane layer portions include a thermosetting polyurethane having a cross-linkage
Implementation Method 2
the first surface has a first fine unevenness for releasability, the second polyurethane layer portion has a second surface opposite to the first polyurethane layer portion, the second surface has a second fine unevenness for releasability
Data Source
AI summary
Disclosed are release films for a semiconductor package and manufacturing methods thereof. A release film for a semiconductor package may include a first polyurethane layer portion and a second polyurethane layer portion disposed on the first polyurethane layer portion. The first polyurethane layer portion may have a first surface opposite to the second polyurethane layer portion, and the first surface may have a first fine unevenness for releasability. The second polyurethane layer portion may have a second surface opposite to the first polyurethane layer portion, and the second surface may have a second fine unevenness for releasability. The first and second polyurethane layer portions may include thermosetting polyurethane having cross-linkage. An intermediate layer portion may be further disposed between the first polyurethane layer portion and the second polyurethane layer portion.