Polyurethane Resin Adhesion Control via Functional Groups

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Solution Overview

Problem

Conventional heat dissipation materials face challenges in achieving low adhesion force without using adhesion force adjusting components like plasticizers, which can compromise material properties or lead to adhesion issues during use.

Innovation Solution

A curable resin composition, specifically a polyurethane-based composition, is developed to exhibit low adhesion force to adherends like aluminum and polyester without using plasticizers, utilizing oil-modified polyol compounds and alcohol compounds to control adhesion and thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If silicone resin is used as the resin binder to achieve low adhesion force, then adhesion force is reduced, but cost increases and contact failure occurs

Engineering Contradiction:
Improveadhesion forceVSAvoidcontact failure
Core Design Contradiction:
ForceVSReliability

Solution Approach 1:

The patent modifies the chemical structure of polyurethane resin by introducing specific functional groups (such as ester groups, carbonate groups, or carbamate groups) to change the adhesion parameters. This allows achieving low adhesion force while maintaining material reliability and avoiding contact failure, without switching to silicone resin.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If polyurethane material is used to achieve high thermal conductivity, then thermal conductivity is improved, but adhesion force becomes too high

Engineering Contradiction:
Improvethermal conductivityVSAvoidadhesion force
Core Design Contradiction:
TemperatureVSForce

Solution Approach 1:

The patent applies local quality modification by incorporating specific functional groups at particular locations within the polyurethane resin structure. These localized chemical modifications create regions with reduced adhesion while maintaining the overall high thermal conductivity of the polyurethane material.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent creates a composite resin system combining polyurethane base material with specific functional group modifications. This composite approach allows the material to exhibit both high thermal conductivity from the polyurethane matrix and low adhesion force from the functional group modifications.

Inventive Principle:
Principle #40Composite materials

3Force

If plasticizer is added to reduce adhesion force, then adhesion force is lowered, but material properties deteriorate and elution occurs

Engineering Contradiction:
Improveadhesion forceVSAvoidmaterial integrity
Core Design Contradiction:
ForceVSStability of the object's composition

Solution Approach 1:

The patent extracts and eliminates the need for plasticizer additives by incorporating adhesion-control functionality directly into the polyurethane resin molecular structure through functional group modifications. This removes the harmful plasticizer component entirely while maintaining the desired low adhesion force.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The functional groups (ester, carbonate, carbamate) act as intermediaries within the polyurethane resin structure that mediate the adhesion properties. These intermediary functional groups provide the low adhesion effect without requiring external plasticizer additives that would compromise material stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20240124640A1Curable Composition
Publication Date: 2024.04.18 LG CHEM LTD
  • US20240124640A1 patent drawing
  • US20240124640A1 patent drawing
  • US20240124640A1 patent drawing

AI summary

A resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity is provided. Also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. A product comprising the curable composition or the cured body thereof is also provided.