Thermosetting Polyurethane Resin Lapping Plate for SiC
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Solution Overview
Problem
The processing of high-hardness, brittle materials like SiC and sapphire is challenging due to their chemical and thermal stability, leading to low productivity and difficulty in achieving uniform abrasive dispersion on lapping plates, resulting in decreased lapping rates and surface scratches.
Innovation Solution
A resin lapping plate made of thermosetting polyurethane resin with a specific elasticity and surface condition, allowing for efficient embedding and retention of diamond abrasive grains, which suppresses scratches and enhances lapping rates by maintaining a polishing slurry and ensuring uniform abrasive action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal-based plates (copper, resin-coated copper, tin) are used with diamond abrasive grains for lapping SiC and sapphire, then the abrasive grains can be embedded in the plate surface, but the embedding process takes a long time and productivity decreases
Solution Approach 1:
The invention changes the material parameter of the lapping plate from metal-based (copper, tin) to resin-based, specifically using a resin with controlled elasticity (0.05 to 0.20 GPa) and hardness (Shore D 20 to 40). This parameter change enables much faster abrasive grain embedding while maintaining effective lapping action on SiC and sapphire surfaces.
Solution Approach 2:
The invention uses a composite structure consisting of a resin base material combined with diamond abrasive grains. The resin matrix provides the necessary elasticity and hardness characteristics, while the embedded diamond grains provide the cutting action. This composite approach optimizes both embedding speed and lapping effectiveness.
2Loss of time
If free diamond abrasive grains are used on metal-based plates, then the abrasive grains can be embedded quickly, but uniform dispersion of abrasive grains on the whole plate becomes difficult and scratches occur on the workpiece surface
Solution Approach 1:
By changing the resin material parameters (elasticity of 0.05 to 0.20 GPa and Shore D hardness of 20 to 40), the plate surface provides optimal retention and uniform distribution of abrasive grains. The specific elasticity range ensures grains are held firmly yet can be uniformly dispersed, preventing scratches while maintaining embedding efficiency.
Solution Approach 2:
The resin plate provides locally optimized properties across its surface - the specific elasticity and hardness create uniform local conditions for abrasive grain embedding and retention. This ensures consistent grain distribution throughout the entire plate surface, preventing localized scratch formation.
3Reliability
If conventional lapping plates are used for SiC and sapphire processing, then the chemical and thermal stability of these materials can be handled, but the lapping rate decreases and productivity is reduced
Solution Approach 1:
The resin-diamond composite plate combines the chemical inertness and thermal stability needed for processing SiC and sapphire with the high cutting efficiency of diamond abrasives. This composite structure maintains reliability for handling these difficult materials while achieving significantly higher lapping rates.
Solution Approach 2:
Changing from metal-based plates to resin-based plates with specific elasticity (0.05 to 0.20 GPa) and hardness parameters enables faster material removal rates. The resin material parameters are optimized to work effectively with diamond grains, achieving high lapping rates on chemically and thermally stable materials like SiC and sapphire.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin lapping plate achieves a high lapping rate while minimizing scratches on the workpiece surface, improving the flatness and reducing surface defects, thus enhancing the processing efficiency and quality of SiC and sapphire substrates.
Implementation Method 1
a resin sheet comprising a thermosetting polyurethane resin and having an opening rate of 10 to 50% and a Young's modulus of 7.0 × 10 7 to 2.0 × 10 8 N/m 2
Implementation Method 2
allowing for efficient embedding and retention of diamond abrasive grains
Implementation Method 3
diamond abrasive grains, which suppresses scratches and enhances lapping rates
Data Source
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AI summary
The present invention provides a lapping plate, which provides a high lapping rate and also can suppress the generation of scratches on a surface of a polishing workpiece. The present invention provides a resin lapping plate comprising a resin sheet comprising a thermosetting polyurethane resin and having an opening rate of 10 to 50% and a Young's modulus of 7.0 × 107 to 5.0 × 108 N/m2.