Polyurethane Thermal Interface Composition With Low Adhesion
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Solution Overview
Problem
Existing heat dissipation materials face challenges in achieving low adhesion force while maintaining high thermal conductivity, and they often require rapid curing which limits the time for part replacement or position change during application.
Innovation Solution
A curable resin composition, particularly a polyurethane-based composition, is formulated to exhibit low adhesion force without plasticizers, with controlled curing rates, ensuring flexibility in application and maintaining thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If silicone resin is used as the resin binder to achieve low adhesion force, then adhesion force is reduced, but cost increases and contact failure occurs
Solution Approach 1:
The patent modifies the chemical structure of polyurethane resin by introducing specific functional groups (such as carbamate groups and urea groups) to adjust the molecular polarity and intermolecular forces. This parameter change allows the resin to achieve low adhesion force while maintaining contact stability, eliminating the need for silicone resin additives.
Solution Approach 2:
The patent creates a composite thermal interface material by combining polyurethane resin with thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride). This composite structure achieves both low adhesion force and high thermal conductivity, while the polyurethane matrix provides reliable contact stability without silicone resin.
2Temperature
If polyurethane material is used to achieve high thermal conductivity, then thermal conductivity is improved, but adhesion force increases
Solution Approach 1:
The patent adjusts the molecular weight, soft segment/hard segment ratio, and functional group composition of the polyurethane resin to optimize the balance between thermal conductivity and adhesion force. By changing these parameters, the resin achieves high thermal conductivity while maintaining low adhesion force suitable for removable thermal interface applications.
3Force
If plasticizer is added to lower adhesion force, then adhesion force is reduced, but material merits are damaged and elution occurs
Solution Approach 1:
The patent extracts and eliminates the need for plasticizer additives by fundamentally modifying the polyurethane resin molecular structure. The intrinsic molecular design provides low adhesion force without requiring external plasticizer components, thereby preventing elution and maintaining material stability throughout the product lifecycle.
4Productivity
If rapid curing is used to improve productivity, then curing speed increases, but application time and waiting time are reduced
Solution Approach 1:
The patent introduces a dual-cure mechanism where the polyurethane resin can undergo controlled gradual curing through moisture exposure or temperature adjustment. This dynamic curing process allows operators sufficient application and adjustment time, then accelerates to complete curing, providing both workability and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low adhesion force to adherends, controlled curing, and high thermal conductivity, allowing for flexible application and improved process efficiency.
Implementation Method 1
a curable component, and a cured body of the curable composition, wherein the curable composition comprises a curable component capable of forming a crosslinked structure through a curing reaction
Data Source
AI summary
A curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity. Also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability. A product may comprise the curable composition, or a cured body thereof, or a thermal interface material thereof.