Polyurethane TIM Composition With Low Adhesion and Controlled Cure
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Solution Overview
Problem
Existing heat dissipation materials face challenges in achieving low adhesion force while maintaining high thermal conductivity, and rapid curing can limit the time for part replacement or position change, especially when using polyurethane materials.
Innovation Solution
A curable resin composition, particularly a polyurethane-based composition, is formulated to exhibit low adhesion force without plasticizers, with controlled curing rates, ensuring flexibility in application and curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyurethane material is used to form heat dissipation material with high thermal conductivity, then thermal conductivity is improved, but adhesion force becomes too high making part replacement difficult
Solution Approach 1:
The patent removes plasticizers from the polyurethane composition that would normally be used to reduce adhesion force. Instead, it achieves low adhesion force through a different mechanism: using a polyol compound with specific molecular structure (high molecular weight, specific functional groups) that inherently provides low adhesion to adherends while maintaining high thermal conductivity, eliminating the need for plasticizers that cause other problems.
Solution Approach 2:
The patent changes the chemical composition parameters of the polyol compound used in the polyurethane system. Specifically, it uses a polyol compound with a molecular weight of 1,000-10,000 and specific functional groups that result in a cured product with both high thermal conductivity and low adhesion force, fundamentally altering the material properties to simultaneously achieve both goals.
2Productivity
If curing speed is increased to improve productivity, then curing time is reduced, but the time for part replacement or position change becomes insufficient
Solution Approach 1:
The patent creates a dynamic curing process where the viscosity and hardness of the material change over time in a controlled manner. The composition is designed so that initially the material remains relatively soft and workable, allowing sufficient time for part replacement or position adjustment, and then progresses to full curing strength. This is achieved through the specific polyol compound selection that provides appropriate cure kinetics.
3Force
If plasticizers are added to reduce adhesion force, then adhesion force is lowered, but the inherent merits of the material are damaged or plasticizers are eluted during use
Solution Approach 1:
The patent explicitly removes plasticizers from the composition formulation. Instead of using plasticizers to control adhesion force, it achieves the desired low adhesion force through the inherent properties of the polyol compound and the cured polyurethane structure itself, thereby eliminating the reliability issues associated with plasticizer elution and material property degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low adhesion force to adherends, maintains high thermal conductivity, and allows for precise control over curing, facilitating easier part replacement and extended application time without compromising material properties.
Implementation Method 1
a curable component, and a cured body of the curable composition
Implementation Method 2
a curable resin composition, particularly a polyurethane-based composition, is formulated to exhibit low adhesion force without plasticizers, with controlled curing rates
Data Source
AI summary
Provided are a curable composition, a cured body thereof or a thermal interface material (TIM), and a use thereof, wherein the curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity, and the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability.