Pooled Liquid Metal Socket Interconnects for Low-Resistance Signaling

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Solution Overview

Problem

Liquid metal interconnects in integrated circuit devices face challenges with higher resistance compared to traditional solder materials, which may require increased pin counts and are not suitable for future high-speed interconnect standards due to reduced conductivity.

Innovation Solution

Implementing pooled liquid metal wells that connect multiple pads/pins, reducing bulk resistance and electromagnetic interference, and allowing for easier connection management in high-speed applications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If liquid metal interconnects are used instead of traditional solder materials, then separable and reusable interconnections are achieved, but resistance increases and conductivity decreases

Engineering Contradiction:

ImprovereusabilityVSAvoidconductivity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

Multiple individual liquid metal wells are merged into a single pooled well that accommodates multiple pins, creating a common conductive path that reduces overall resistance while maintaining the separable and reusable characteristics of liquid metal interconnects

Inventive Principle:

Principle #5Merging (Combining)

2Force

If liquid metal interconnects are used, then low insertion force is achieved, but resistance increases requiring increased pin counts

Engineering Contradiction:

Improveinsertion forceVSAvoidpin count

Core Design Contradiction:

ForceVSQuantity of substance

Solution Approach 1:

Multiple pins are combined within a single pooled liquid metal well, reducing the effective number of separate interconnect paths needed and lowering the total pin count requirement while maintaining low insertion force characteristics

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If traditional solder-based interconnection technologies are used, then low resistance is achieved, but permanent interconnections are created

Engineering Contradiction:

ImproveconductivityVSAvoidpermanence

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The physical state of the interconnect material is changed from solid (solder) to liquid, enabling separable connections while using pooling geometry to achieve low resistance characteristics typically associated with permanent solder joints

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces resistance and electromagnetic interference, providing a compliant interconnect solution that meets future high-speed performance requirements without the need for reflow processes.

Implementation Method 1

Implementing pooled liquid metal wells that connect multiple pads/pins, reducing bulk resistance

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

Implementing pooled liquid metal wells that connect multiple pads/pins, reducing bulk resistance and electromagnetic interference

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20250309091A1Liquid metal socket interconnects with pooled wells

Publication Date: 2025.10.02 INTEL CORP

AI summary

In one embodiment, an integrated circuit assembly includes a liquid metal (LM)-based interconnect with pooled or interconnected wells. The pooled wells may interconnect multiple pins of the LM-based interconnect.