PoP Antenna Package Structure for Low-Warpage RF Integration

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Solution Overview

Problem

Current semiconductor packaging technologies face challenges in achieving smaller sizes, higher bandwidth, and reduced power consumption while managing warpage issues and manufacturing costs, especially with the integration of antennas in electronic devices.

Innovation Solution

A package-on-package (PoP) structure is developed with a stacked patch antenna bonded to a semiconductor package, separated by an air cavity with low permittivity and loss tangent properties, reducing conductive vias and using a single layer of encapsulant to decrease warpage and manufacturing costs, while enhancing bandwidth and gain through electromagnetic coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional semiconductor packaging with integrated antennas is used, then device size can be reduced, but warpage issues increase and manufacturing costs rise

Engineering Contradiction:

Improvedevice sizeVSAvoidwarpage

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The packaging structure is divided into separate modules: a semiconductor package and a stacked patch antenna structure, which are bonded together through conductive connectors. This segmentation allows each component to be optimized independently, reducing overall warpage while maintaining compact form factor.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The antenna structure is stacked vertically above the semiconductor package, creating a three-dimensional nested arrangement. This vertical integration reduces the horizontal footprint and device size while maintaining structural stability through the air cavity separation.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If multiple conductive vias are used to connect antenna to semiconductor package, then electrical connection is improved, but power consumption increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidpower consumption

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent extracts and eliminates unnecessary conductive vias from the traditional packaging structure. By using a reduced number of conductive connectors, the design reduces resistive losses and power consumption while maintaining reliable electrical connection between the antenna and semiconductor package.

Inventive Principle:

Principle #2Taking out (Extraction)

3Strength

If multiple layers of encapsulant are used in package structure, then structural integrity is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvestructural integrityVSAvoidmanufacturing complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent merges multiple encapsulant layers into a single-layer encapsulant structure that provides sufficient structural integrity. This consolidation simplifies the manufacturing process, reduces material costs, and decreases warpage while maintaining the necessary mechanical strength and protection for the integrated antenna structure.

Inventive Principle:

Principle #5Merging (Combining)

4Adaptability or versatility

If air cavity with low permittivity is used between semiconductor package and antenna, then bandwidth and gain are improved, but manufacturing precision requirements increase

Engineering Contradiction:

ImprovebandwidthVSAvoidair cavity formation precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent utilizes the electromagnetic parameter (permittivity) of the air cavity to enhance bandwidth and gain. By maintaining an air-filled cavity with low permittivity between the semiconductor package and antenna structure, the design achieves improved RF performance without requiring complex additional materials, thereby balancing manufacturing precision requirements.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces power consumption, decreases warpage, and lowers manufacturing costs while increasing bandwidth and gain by using an air cavity and single-layer encapsulant in the PoP structure, effectively addressing the limitations of conventional packaging technologies.

Implementation Method 1

enhancing bandwidth and gain through electromagnetic coupling

Methodology Applied

Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Implementation Method 2

separated by an air cavity with low permittivity and loss tangent properties

Methodology Applied

Scientific EffectPermittivity: Dielectric Permittivity

Data Source

PatentUS11855011B2Package structure and method of forming the same

Publication Date: 2023.12.26 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.