Package-on-Package RF Antenna Integration for Low-Loss Waveguide Routing
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Solution Overview
Problem
Existing semiconductor device packages face challenges in accommodating higher performance features and applications while maintaining enhanced performance without significant cost impact.
Innovation Solution
A package-on-package semiconductor device is designed with an integrated antenna sub-assembly, featuring a non-conductive antenna substrate, antenna substrate waveguide, and antenna structure, aligned with a waveguide through the package substrate, allowing for a low-loss RF signal path that avoids obstruction by device components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional semiconductor device packaging is used, then device complexity is reduced and manufacturing is easier, but RF signal transmission loss increases and performance is constrained
Solution Approach 1:
The patent merges the antenna structure with the package substrate by integrating the antenna into the package substrate itself, creating an integrated antenna-package structure. This combination eliminates the need for separate antenna components and reduces RF signal transmission loss while managing the complexity through consolidation of functions.
Solution Approach 2:
The antenna structure is nested within the package substrate layers, with the antenna embedded in the substrate between the semiconductor die and the external environment. This nesting approach allows the antenna to be housed within the existing package structure without significantly increasing overall device complexity.
2Reliability
If higher performance features are added to semiconductor devices, then device performance is enhanced, but manufacturing cost increases significantly
Solution Approach 1:
The package substrate serves multiple functions: it provides mechanical support for the semiconductor die, acts as an RF transmission medium with integrated waveguides, and houses the antenna structure. This multi-functionality allows enhanced RF performance without requiring separate dedicated components for each function, thereby controlling manufacturing costs.
Solution Approach 2:
The package structure is segmented into functional layers including the package substrate, semiconductor die, and integrated antenna components. This segmentation allows each layer to be optimized for its specific function while maintaining overall cost-effectiveness through standardized manufacturing processes for each segment.
3Loss of energy
If antenna components are added to semiconductor devices, then RF signal transmission capability is improved, but device complexity and component obstruction increase
Solution Approach 1:
The antenna is merged with the package substrate to form an integrated structure, eliminating the need for separate antenna components that would increase device complexity. The antenna traces are formed directly on the substrate, reducing component count and simplifying the overall device configuration.
Solution Approach 2:
The antenna structure utilizes the substrate plane and transitions to three-dimensional radiation elements, effectively using available space in different dimensions. This approach allows RF signal transmission capability to be improved without adding excessive complexity by efficiently utilizing the spatial dimensions within the package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated antenna configuration enables efficient RF signal transmission with reduced loss, enhancing performance without increasing costs.
Implementation Method 1
an antenna substrate waveguide, and an antenna structure. The waveguide of the antenna sub-assembly is aligned with a waveguide formed through the package substrate
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
A method of forming a package-on-package semiconductor device is provided. The method includes mounting an antenna sub-assembly on a first major side of a package substrate and a packaged RF semiconductor device on a second major side of the package substrate. The antenna sub-assembly includes an antenna substrate, an antenna substrate waveguide, and an antenna structure. The antenna substrate waveguide is aligned with a waveguide formed through the package substrate. The packaged RF semiconductor device includes a semiconductor die, an RDL formed over an active side of the first semiconductor die, and a signal launcher formed from a conductive layer of the RDL. The signal launcher is configured for propagation of an RF signal through the waveguide formed through the package substrate and the antenna substrate waveguide.