Package-on-Package Connector Alignment via Molding Recesses
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Solution Overview
Problem
The semiconductor industry faces challenges in manufacturing package on package (PoP) structures due to the complexity of forming precise openings in molding compounds to accurately align and bond connectors, leading to potential shorting and increased manufacturing time.
Innovation Solution
A method involving a material removal tool with a diamond-tipped tip of various shapes to remove portions of connectors and molding compound, creating openings that allow for accurate placement and bonding of additional connectors, reducing the risk of shorting and simplifying the alignment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If openings are formed in molding compound to align and bond connectors, then connector bonding accuracy is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the molding compound before connector placement. These recesses are created in advance to guide and align connectors during bonding, eliminating the need for complex real-time alignment procedures and reducing manufacturing steps while maintaining high precision.
Solution Approach 2:
The recesses in the molding compound serve as an intermediary structure that facilitates connector alignment and bonding. These recesses act as a mediator between the connector and the package substrate, providing a predefined pathway and positioning feature that simplifies the bonding process while ensuring accurate alignment.
2Manufacturing precision
If openings are formed in molding compound to place connectors, then connector placement accuracy is improved, but risk of shorting increases
Solution Approach 1:
The patent applies local quality by creating localized recesses in the molding compound only at specific positions where connectors need to be placed. These recesses provide localized guidance and positioning features without affecting the entire molding compound structure, thereby ensuring accurate placement while maintaining proper isolation between connectors to prevent shorting.
3Shape
If material removal is performed on connectors and molding compound, then bonding profile smoothness is improved, but processing time increases
Solution Approach 1:
The patent applies preliminary action by pre-forming the recesses in the molding compound during the molding process itself, before connector placement and bonding. This preliminary formation of the bonding interface geometry eliminates the need for subsequent material removal steps, achieving smooth bonding profiles while significantly reducing processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a smoother bonding profile, reduced likelihood of cracking, improved yield, and a more consistent form factor, with a wider process window and increased precision in connector placement, thereby enhancing the efficiency and reliability of the PoP structure.
Implementation Method 1
A method involving a material removal tool with a diamond-tipped tip of various shapes to remove portions of connectors and molding compound
Data Source
AI summary
A method of forming a semiconductor device package includes bonding a first connector to a first conductive structure on a first package. The method includes bonding a die to a surface of the first package, wherein a top surface of the first connector extends above a top surface of the die. The method includes surrounding the first connector with a molding compound. The method includes removing a portion of the first connector and a portion of the molding compound. The top surface of the remaining first conductor is below the top surface of the die. A first top surface of the remaining molding compound is below the top surface of the die. A second top surface of the remaining molding compound is level with the top surface of the die. The method includes bonding a second connector to the remaining portion of the first connector.