Package-on-Package Cooling via Downward Thermal Pathways

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Solution Overview

Problem

High-power and high-density semiconductor systems face challenges in effective thermal management due to limited surface area for heat dissipation, leading to potential device damage from overheating, especially in package-on-package structures where conventional thermal transfer systems struggle to efficiently remove heat from embedded logic devices.

Innovation Solution

The implementation of heat conductive pathways using heat-conductive materials like copper, aluminum, and metal vias within the package substrate and printed circuit board to direct heat generated by the logic package downward to the package substrate and PCB, enhancing thermal dissipation through electroplating or semi-solid paste filling processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If conventional thermal transfer systems are used with heat sinks positioned above the package structure, then heat dissipation surface area is increased, but thermal pathways become difficult to provide for embedded logic devices in package-on-package structures

Engineering Contradiction:

Improveheat dissipation surface areaVSAvoidthermal pathway complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

Instead of removing heat upward from the top of the package structure through heat sinks, this patent inverts the thermal pathway by removing heat downward through the package substrate to the PCB. The heat conductive pathways extend from the logic package through the package substrate to the PCB, allowing heat to be conducted away from the embedded logic device in the opposite direction of conventional approaches.

Inventive Principle:

Principle #13The other way round (Inversion)

2Productivity

If package-on-package structures are used to increase integration density, then surface area for heat dissipation is reduced, but thermal management requirements become more stringent

Engineering Contradiction:

Improveintegration densityVSAvoidheat dissipation capability

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

This patent transitions from two-dimensional heat dissipation (surface-mounted heat sinks) to three-dimensional heat management by utilizing the vertical dimension through the package substrate and PCB. The heat conductive pathways extend through multiple layers and dimensions, including thermal vias through the substrate and heat spreaders, effectively using the Z-dimension to manage thermal flow in high-density package-on-package structures.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Loss of energy

If heat sinks are coupled to the package lid for thermal management, then heat dissipation is improved, but effective thermal pathways to remove heat from embedded logic devices become difficult to provide

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal pathway implementation

Core Design Contradiction:

Loss of energyVSEase of operation

Solution Approach 1:

This patent introduces intermediary thermal management components between the logic package and the external environment. These include heat conductive pathways within the package substrate, thermal vias, heat spreaders, and thermal interface materials that mediate the heat transfer from the embedded logic device through multiple intermediate layers to the PCB, where heat can be effectively dissipated.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively increases the performance of package-on-package structures by maintaining optimal temperature conditions and reducing hot zones, improving heat dissipation efficiency and reducing thermal warpage.

Implementation Method 1

heat conductive pathways being provided in the package-on-package structure for removing heat from the logic package, wherein the heat conductive pathways enable a downward transfer of heat generated by the logic package

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

enhancing thermal dissipation through electroplating or semi-solid paste filling processes

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS20250006673A1Cooling Methodology for Package-on-Package Structures

Publication Date: 2025.01.02 INTEL CORP

AI summary

The present disclosure is directed to package-on-package structures having a package substrate with an embedded logic package disposed on the package substrate and having heat conductive pathways being provided in the package-on-package structure for removing heat from the logic package. In an aspect, the heat conductive pathways enable a downward transfer of the heat generated by the logic package toward the package substrate. In another aspect, the heat conducting pathways may include a heat transfer layer formed proximally to a bottom surface of the logic package. In a further aspect, the heat conducting pathways may include one or more metal vias in the package substrate.