PoP Gap Controller for Void-Free Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The presence of voids between integrated circuit packages in package-on-package (PoP) devices leads to warpage and deformation, resulting in weak or open joints due to insufficient structural support, which affects signal transmission and device reliability.
Innovation Solution
Incorporating a gap controller between the packages to provide a minimum gap, ensuring mechanical support and allowing the encapsulation layer to fill the space, thereby preventing void formation and enhancing structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the gap between the first die and the second package substrate is reduced to minimize package size, then the package height and footprint are reduced, but voids form between the packages causing warpage and weak joints
Solution Approach 1:
The patent introduces an encapsulation layer as an intermediary substance that fills the gap between the first die and the second package substrate. This encapsulation layer acts as a mediator that provides structural support, prevents void formation, and maintains joint strength while allowing the gap to be minimized for compact packaging.
Solution Approach 2:
The patent changes the physical and chemical parameters of the gap space by filling it with an encapsulation material. This transforms the gap from an empty void that causes warpage into a structurally supportive filled space, thereby maintaining reliability while enabling reduced package dimensions.
2Ease of manufacture
If the gap between the first die and the second package substrate is reduced to achieve better form factor, then the package is more compact and cheaper to fabricate, but the encapsulation layer cannot completely flow in between the packages creating voids
Solution Approach 1:
The patent applies preliminary action by pre-forming the encapsulation layer with sufficient volume and流动性 characteristics before the packaging process. This ensures that the encapsulation material can completely fill the gap between the first die and second package substrate during assembly, preventing void formation even when the gap is minimized for compact design.
Solution Approach 2:
The patent optimizes the rheological parameters of the encapsulation material, ensuring it has appropriate viscosity and flow characteristics that allow complete filling of the gap space during the packaging process, thereby achieving both compact dimensions and void-free encapsulation.
Data Source
Figure 1
Figure 2
Figure 3~5
AI summary
A package on package (PoP) device that includes a first package, a second package that is coupled to the first package, and at least one gap controller located between the first package and the second package, where the at least one gap controller is configured to provide a minimum gap between the first package and the second package. The first package includes a first electronic package component (e.g., first die). In some implementations, the at least one gap controller is coupled to the first package, but free of coupling with the second package. The at least one gap controller is located on or about a center of the first package. The at least one gap controller may be located between the first electronic package component (e.g., first die) and the second package. The package on package (PoP) device may include an encapsulation layer between the first package and the second package.