Semiconductor Package Interface Material for PoP Heat Dissipation
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high integration density and efficient heat dissipation in packaging technologies, particularly in Package-on-Package (PoP) structures, where traditional interface materials can impede bump joint performance and lead to defects due to their non-compressible nature.
Innovation Solution
The use of a compressible interface material with high thermal conductivity, stiffness, and tensile strength, such as lead-tin based solder or carbon composite materials, is introduced to connect integrated circuit dies with overlying structures, allowing for efficient heat dissipation and maintaining structural support without impeding conductive connector placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional non-compressible interface materials are used to connect semiconductor dies, then structural support is maintained, but heat dissipation efficiency deteriorates and bump joint defects increase
Solution Approach 1:
The patent applies parameter changes by transitioning from non-compressible interface materials to compressible interface materials with specific physical properties (compressibility, thermal conductivity, stiffness, tensile strength). This parameter change enables the interface material to simultaneously provide thermal management benefits through compression-induced thermal pathways while maintaining structural support and improving bump joint performance through controlled deformation.
Solution Approach 2:
The patent employs composite materials by combining multiple material properties in the interface material layer. The interface material is designed as a composite with specific combinations of compressibility, thermal conductivity, stiffness, and tensile strength, allowing it to fulfill multiple functions: thermal dissipation, structural support, and mechanical compliance for improved bump joint performance.
2Strength
If interface material is applied extensively to ensure coverage, then structural support is improved, but material cost and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by positioning the compressible interface material specifically at critical locations where thermal and mechanical management is most needed. Rather than uniform extensive coverage, the interface material is applied in targeted areas to provide local thermal pathways and mechanical compliance, reducing overall material usage and simplifying manufacturing while maintaining structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat removal from semiconductor dies during operation while maintaining structural integrity, reducing defects in bump joint performance and lowering overall costs by using less material and optimizing the placement of the interface material.
Implementation Method 1
The use of a compressible interface material with high thermal conductivity... is introduced to connect integrated circuit dies with overlying structures, allowing for efficient heat dissipation
Implementation Method 2
The use of a compressible interface material... allowing for efficient heat dissipation and maintaining structural support without impeding conductive connector placement
Data Source
AI summary
Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.