Package-on-Package Thermal Management via Lateral Heat Dissipation
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Solution Overview
Problem
In the field of semiconductor packaging, there is a need for a compact package-on-package (POP) structure that effectively dissipates heat generated by semiconductor chips while minimizing package thickness, especially in systems requiring complexation and multifunctionality.
Innovation Solution
A POP package is configured by arranging a heat sink around an upper package, incorporating a first semiconductor package with a core member and a second semiconductor package stacked on top, where the second package includes a wiring substrate with semiconductor chips and a heat dissipation member covering its lateral surface to enhance thermal management without increasing package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is arranged around an upper package in a POP structure, then heat dissipation effectiveness is improved, but package thickness increases
Solution Approach 1:
The heat dissipation member is disposed within the lateral space of the lower package, nesting the thermal management function inside the existing package footprint rather than adding external thickness. This allows the heat sink to be integrated into the lower package's lateral volume, effectively dissipating heat from the upper package without increasing overall package thickness.
Solution Approach 2:
The solution transitions from vertical heat dissipation (adding thickness) to lateral heat dissipation (using horizontal space). By positioning the heat dissipation member to extend laterally within the lower package's footprint, the design utilizes the third dimension (lateral width) instead of increasing the second dimension (thickness), thereby maintaining a thin profile while achieving effective thermal management.
2Volume of stationary object
If a compact POP structure is implemented, then package size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation member is nested within the lateral space of the lower package, utilizing the existing package volume for dual purposes: structural support and thermal management. This nesting approach maintains compact overall dimensions while incorporating effective heat dissipation functionality without requiring additional external space.
Solution Approach 2:
The lower package serves multiple functions simultaneously: it provides structural support for the upper package, contains the heat dissipation member for thermal management, and utilizes its lateral space for heat sinking. This multi-functionality allows the compact POP structure to achieve both size reduction and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures effective heat dissipation for semiconductor chips, maintaining a compact package size and improving thermal characteristics, thus addressing the challenge of heat management in densely packed semiconductor systems.
Implementation Method 1
a heat dissipation member covering a lateral surface of the second semiconductor package
Data Source
AI summary
A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.