Package-on-Package Memory Mixing with NUMA and Thermal Control
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Solution Overview
Problem
There is a need for improved package-on-package (PoP) integrated circuit assemblies that incorporate different types of dynamic random access memory (DRAM) to enhance performance and reduce overall size, while also allowing for customization and flexibility in memory options to meet the specific needs of individual processing modules.
Innovation Solution
The PoP assemblies include a system-on-chip (SoC) with a non-uniform memory access (NUMA) mechanism, combining two different types of memory dies and a heat sink, which allows for mixing memory types and densities within the same package, and can implement processor-in-memory (PIM) capabilities, enabling tailored memory options for specific processing modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different types of memory devices are integrated in the same PoP assembly, then memory customization and performance are improved, but device complexity increases
Solution Approach 1:
The PoP assembly is segmented into distinct memory regions, with first memory devices (e.g., LPDDR5) and second memory devices (e.g., LPDDR6) separately mounted on the substrate. Each memory type can be independently selected and configured, allowing customization without requiring complete redesign of the entire memory system.
Solution Approach 2:
The substrate is designed with universal mounting capabilities that support multiple memory device types and configurations. The same substrate can accommodate different combinations of memory devices, enabling a single platform to serve multiple customization needs without requiring specialized substrates for each configuration.
2Productivity
If multiple different types of memory devices are included in the PoP assembly, then performance and flexibility are enhanced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into independent steps for mounting different memory device types. First memory devices are mounted in specific regions, then second memory devices are mounted in other regions, allowing each type to be manufactured and mounted separately before final assembly, thereby simplifying the overall manufacturing complexity.
Solution Approach 2:
Different regions of the substrate are optimized for specific memory device types based on their thermal and electrical characteristics. First memory devices are placed in regions with appropriate thermal management, while second memory devices are placed in regions optimized for their specific requirements, enabling customized performance without complicating the global manufacturing process.
3Productivity
If first memory devices and second memory devices of different types are coupled to the substrate, then memory performance and customization are improved, but heat dissipation management becomes more challenging
Solution Approach 1:
Different thermal management solutions are applied to different memory device types based on their specific thermal characteristics. First memory devices may be coupled with first heat sinks optimized for their thermal profile, while second memory devices are coupled with second heat sinks designed for their different thermal requirements, allowing effective heat dissipation management for each memory type independently.
Solution Approach 2:
The thermal management system is segmented into separate heat dissipation paths for different memory device types. This allows independent optimization of cooling strategies for each memory type, preventing thermal interference between different memory devices and maintaining stable operating temperatures despite the diversity of memory types in the assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances processing capabilities and reduces costs by allowing for flexible memory customization, supporting advanced memory types like LPDDR5 and LPDDR6, and efficiently managing heat dissipation, thus improving performance and reducing power consumption.
Implementation Method 1
a heat sink covering at least a portion of the top package may be included to conduct heat away from the two memory dies
Data Source
AI summary
Various embodiments may include a Package on Package (PoP) having a bottom package comprising a system-on-chip (SoC) and a bottom substrate, a top package comprising a top substrate, a first memory die, and a second memory die, wherein the first and second memory dies are different in at least one of: memory type, memory density, or memory capacity, an interposer electronically connecting the top package and the bottom package, and a heat sink covering at least a portion of the top package. The SoC may include a non-uniform memory access (NUMA) mechanism configured to manage data interleaving, memory write requests, memory access requests across the first and second memory dies.