Package-on-Package Memory Refresh Rate Control via Thermal Feedback
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Solution Overview
Problem
In package on package (POP) configurations, the heat generated by processor dies can cause data retention issues in memory dies due to thermal challenges, leading to potential loss of memory data, and existing solutions often require external software control or thermal management that may not be efficient or effective.
Innovation Solution
A hardware control circuit embedded within the System on a Chip (SoC) or processor die manages the memory refresh and self-refresh rates based on thermal sensor inputs from both the processor and memory dies, adjusting the refresh rate to maintain data retention without external dependencies, thereby preemptively managing thermal gradients and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the processor die operates at high performance, then processing speed is improved, but thermal heat generation increases causing data retention issues in memory die
Solution Approach 1:
The patent implements a feedback mechanism where thermal sensors continuously monitor temperature in the memory die and processor die, and the hardware control circuit dynamically adjusts the refresh rate based on real-time thermal conditions. When temperature exceeds thresholds, the system increases refresh rates to prevent data loss, creating a closed-loop control system that responds to thermal feedback.
Solution Approach 2:
The patent employs preliminary action by proactively increasing the memory refresh rate before data loss occurs. The hardware control circuit monitors thermal conditions and preemptively adjusts refresh rates when temperature thresholds are approached, preventing data retention issues before they manifest rather than reacting after data loss occurs.
2Reliability
If external software control is used for thermal management, then data retention can be managed, but system complexity and control efficiency deteriorate
Solution Approach 1:
The patent applies self-service by embedding the thermal management functionality directly within the processor die. The hardware control circuit, thermal sensors, and memory interface work together as an integrated self-managing system that automatically monitors and adjusts memory refresh rates based on thermal conditions without requiring external software intervention or complex operating system management.
Solution Approach 2:
The patent merges thermal sensing, control logic, and memory refresh management into a single integrated hardware system. The hardware control circuit combines multiple functions (temperature monitoring, threshold comparison, refresh rate control) into one unified control mechanism, simplifying the overall system architecture and eliminating the need for separate external software control layers.
3Reliability
If the memory refresh rate is increased to prevent data loss, then data retention is improved, but power consumption increases
Solution Approach 1:
The patent implements dynamics by making the memory refresh rate adjustable and adaptive rather than fixed. The hardware control circuit dynamically changes the refresh rate based on real-time thermal conditions, increasing refresh rates only when thermal thresholds are exceeded and maintaining lower rates when cooling is sufficient, creating a flexible adaptive system.
Solution Approach 2:
The patent applies parameter changes by modifying the memory refresh rate parameter in response to thermal conditions. The system changes operational parameters (refresh rate) based on environmental factors (temperature), transitioning between different operational states to balance data retention requirements with power consumption efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable data retention in memory dies by dynamically adjusting refresh rates in response to thermal conditions, optimizing power and performance within the POP configuration, and preventing data loss due to thermal issues.
Implementation Method 1
thermal sensor inputs from both the processor and memory dies
Data Source
AI summary
Methods, systems, and apparatuses relating to package on package memory refresh and self-refresh rate management are described. In one embodiment, an apparatus includes a processor die, a dynamic memory die mounted to and overlapping the processor die, a first thermal sensor of the processor die disposed adjacent to a first hot spot from a first type of workload and a second thermal sensor of the processor die disposed adjacent to a second hot spot from a second type of workload, and a hardware control circuit of the processor die to cause a refresh of a capacitor of the dynamic memory die when either of an output of the first thermal sensor exceeds a first threshold value and an output of the second thermal sensor exceeds a second threshold value.