POP Package Shielding Can With Conductive Coating for EMI and Heat
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Solution Overview
Problem
Semiconductor packages face challenges in effectively shielding electromagnetic interference (EMI) while also dissipating heat, as traditional shielding structures can hinder heat dissipation.
Innovation Solution
An electronic device design featuring a base substrate with a POP package, a conformal conductive coating on the upper surface of the second package, and a shielding can that is electrically connected to a ground pad, with a metal paste bonding the shielding can to the conformal conductive coating, allowing for both electromagnetic shielding and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding can is used to shield electromagnetic waves, then electromagnetic shielding performance is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The shielding structure is divided into two functional parts: a shielding can made of magnetic shielding material for EMI protection, and a heat dissipation plate made of thermally conductive material for heat removal. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The invention uses composite material strategy by combining magnetic shielding material with thermally conductive material in a single integrated structure. The shielding can incorporates both types of materials to simultaneously achieve electromagnetic shielding and heat dissipation functions.
2Object-affected harmful factors
If a conformal conductive coating is applied on the upper surface of the sealing material, then electromagnetic shielding is enhanced, but manufacturing complexity increases
Solution Approach 1:
The conformal conductive coating is integrated directly onto the upper surface of the sealing material during the packaging process, combining the sealing function and electromagnetic shielding function into a single unified structure, thereby reducing the number of separate manufacturing steps.
Solution Approach 2:
The conformal conductive coating is formed on the sealing material before final assembly, preparing the electromagnetic shielding layer in advance to simplify subsequent manufacturing steps and reduce overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields electromagnetic waves and enhances heat dissipation performance by grounding the conformal conductive coating and using a thinner conformal conductive coating that exposes to the surface for better thermal management.
Implementation Method 1
A metal paste is between the shielding can and the conformal conductive coating and contacts the shielding can and the conformal conductive coating
Implementation Method 2
A conformal conductive coating on at least an upper surface of the sealing material... enhances heat dissipation performance by grounding the conformal conductive coating
Data Source
AI summary
An electronic device includes a base substrate; a first package mounted on the base substrate, the first package including a first substrate and a first semiconductor chip mounted on the first substrate; a second package mounted on the first package, the second package including a second substrate, a second semiconductor chip mounted on the second substrate, a sealing material surrounding an upper surface of the second substrate and the second semiconductor chip, and a conformal conductive coating formed on at least an upper surface of the sealing material. A conductive fixing portion is secured to a ground pad exposed at an upper surface of the base substrate. A shielding can is secured to the base substrate by the conductive fixing portion and includes a side portion extending around the first and second packages. A metal paste is formed between the shielding can and the conformal conductive coating to contact the shielding can and the conformal conductive coating.