Package-on-Package Semiconductor Layout Without Mold Through Electrodes
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Solution Overview
Problem
The existing package-on-package semiconductor packages face challenges in reducing size and increasing productivity while maintaining stable electrical connections and heat dissipation, particularly in the stacking and mounting of semiconductor devices with varying sizes and functions.
Innovation Solution
The proposed semiconductor package design includes a lower package with a circuit substrate, multiple semiconductor devices connected via through electrodes and redistribution layers, and an upper package mounted on the lower package without through electrodes in the molding members, allowing for compact size and efficient electrical connections, along with an optional heat sink for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through electrodes are included in molding members for stable electrical connections, then electrical connection reliability is improved, but package size and manufacturing complexity increase
Solution Approach 1:
The patent removes through electrodes from the molding members, extracting this function from the packaging structure. Electrical connections are achieved through alternative means (wire bonds or other interconnect structures), allowing the molding compound to focus solely on protective packaging without the complexity and size increase associated with through electrodes.
Solution Approach 2:
The patent separates the electrical connection function from the mechanical packaging function. Molding members are divided into distinct regions: a first molding member that provides electrical connection structures and a second molding member that provides protective coverage, allowing each to be optimized independently for size and function.
2Stability of the object's composition
If multiple semiconductor devices are stacked with through electrodes for stable mounting, then mounting stability is improved, but productivity and manufacturing complexity decrease
Solution Approach 1:
The patent extracts the electrical connection function from the molding process itself, eliminating the need for complex through electrode formation steps during molding. This simplifies the manufacturing process and improves productivity while maintaining stable mounting through alternative connection methods.
Solution Approach 2:
The patent performs electrical connection preparations in advance through separate wiring structures before final assembly, rather than attempting to create through electrodes during the molding process. This preliminary action simplifies the molding step and improves overall manufacturing efficiency.
3Reliability
If molding members include through electrodes for electrical connections, then electrical connectivity is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent removes through electrodes from the molding members, extracting the electrical connection function from the packaging structure. This simplifies the overall device complexity while maintaining electrical connectivity through alternative means such as wire bonds or surface-mounted interconnects.
Solution Approach 2:
The patent segments the device into distinct functional regions: molding members for protection, separate wiring structures for electrical connections, and semiconductor devices for functionality. This segmentation reduces the complexity of individual components while maintaining overall system functionality.
4Volume of stationary object
If compact package design is implemented without through electrodes, then package size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the molding structure into first and second molding members with distinct functions. The first molding member is configured to expose upper surfaces of semiconductor devices for wire bonding, while the second molding member provides protective coverage. This segmentation allows for simplified alignment requirements compared to through electrode structures.
Solution Approach 2:
The patent introduces wire bonds or other interconnect structures as intermediary elements between semiconductor devices and external circuits. These intermediaries provide flexible electrical connections that are less sensitive to alignment precision requirements than rigid through electrode structures.
Data Source
AI summary
A package-on-package type package includes a lower semiconductor package and an upper semiconductor package. The lower semiconductor package includes a first semiconductor device including a through electrode, a second semiconductor device disposed on the first semiconductor device and including a second through electrode electrically connected to the first through electrode, a first molding member covering a sidewall of at least one of the first semiconductor device and the second semiconductor device, a second molding member covering a sidewall of the first molding member, and an upper redistribution layer disposed on the second semiconductor device and electrically connected to the second through electrode.