PoP Package Ring Structure With Recessed Component Protection

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Solution Overview

Problem

Existing semiconductor package structures face challenges in reducing warpage and protecting electronic components, particularly in Package-on-Package (PoP) technology, where component integration density and miniaturization require innovative packaging solutions to prevent damage and facilitate assembly.

Innovation Solution

A ring structure with adjustable footprints is implemented on the substrate, featuring a first and second foot on a single side of the package component, containing the electronic component in a recess and reducing warpage, while allowing easier assembly by separating the component from the feet, and utilizing an adhesive material to attach the ring structure to the substrate for thermal dissipation and stress reduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a ring structure is added to protect the electronic component and reduce warpage, then the protection and warpage reduction are improved, but the device complexity increases

Engineering Contradiction:

Improveprotection of electronic componentVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The ring structure is divided into multiple segments or feet that can be independently formed and positioned. This segmentation allows the structure to provide protection and warpage reduction while maintaining manufacturing simplicity through modular construction processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The ring structure serves multiple functions simultaneously: it protects the electronic component from damage, reduces warpage of the package structure, and provides a framework for adhesive attachment. This multi-functionality reduces the need for separate protective structures, thereby managing complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If the ring structure is attached to the substrate with adhesive material, then the thermal dissipation and stress reduction are improved, but the manufacturing process complexity increases

Engineering Contradiction:

Improvethermal dissipationVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The adhesive material is applied to the ring structure or substrate in advance before final assembly. This preliminary action ensures proper thermal dissipation and stress reduction while allowing the adhesive to cure or set before the component is placed, simplifying the overall manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive material acts as an intermediary between the ring structure and substrate, providing thermal pathways for heat dissipation while accommodating thermal expansion differences. This intermediary layer reduces stress without requiring direct rigid bonding, simplifying the manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the electronic component is contained in a recess between the feet, then the protection is improved, but the manufacturing precision requirements increase

Engineering Contradiction:

Improveprotection of electronic componentVSAvoidrecess positioning precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The recess is formed in advance with sufficient depth and dimensions to accommodate the electronic component with appropriate clearance. This beforehand cushioning ensures that even with normal manufacturing tolerances, the component is protected without requiring ultra-precise positioning.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The ring structure provides localized protection at critical areas where the recess contains the electronic component. The feet extend toward the substrate at specific locations to provide support while maintaining clearance, allowing protection where needed without requiring high precision across the entire structure.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ring structure effectively protects the electronic component, reduces warpage, and simplifies assembly by containing the component within a recess, enhancing the package structure's planarity and thermal dissipation without interfering with the component's thermal management.

Implementation Method 1

utilizing an adhesive material to attach the ring structure to the substrate for thermal dissipation

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

attach the ring structure to the substrate for thermal dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11830859B2Package structures and method for forming the same

Publication Date: 2023.11.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure is provided. The package structure includes a first package component and a second package component. The second package component includes a substrate and an electronic component disposed on the substrate, and the first package component is mounted to the substrate. The package structure further includes a ring structure disposed on the second package component and around the first package component. The ring structure has a first foot and a second foot, the first foot and the second foot extend toward the substrate, the electronic component is covered by the ring structure and located between the first foot and the second foot, and the first package component is exposed from the ring structure.