Package-on-Package Substrate Recess Anti-Mold Flash Feature
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Solution Overview
Problem
Current multi-chip packages face challenges in achieving high integrated circuit density, reliability, and cost-effectiveness due to limitations in testing individual integrated circuits before assembly, potential damage during assembly, and contamination issues during encapsulation, leading to assembly defects and increased costs.
Innovation Solution
An integrated circuit package-on-package system is developed, featuring a mountable substrate with a recess and anti-mold flash features that partially expose the substrate, allowing for reliable electrical and mechanical attachments while preventing contamination, and enabling individual testing of integrated circuits before assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional multi-chip packages are assembled before testing, then integrated circuit density is improved, but assembly process yield and reliability deteriorate due to inability to identify known-good-die
Solution Approach 1:
The patent performs testing of individual integrated circuits before they are assembled into the multi-chip package. This preliminary testing action allows identification of known-good-die (KGD) prior to assembly, ensuring that only tested and verified circuits are mounted on the substrate, thereby improving assembly yield and reliability while maintaining high circuit density
2Quantity of substance
If vertically stacked integrated circuits are assembled, then integrated circuit density is improved, but testing and identification of failure modes becomes more difficult
Solution Approach 1:
The patent segments the testing process from the assembly process by testing individual integrated circuits separately before mounting them vertically on the substrate. This segmentation allows each circuit to be tested and characterized independently, making failure mode identification straightforward even in vertically stacked configurations where circuits are densely packed
3Reliability
If encapsulation process is performed, then integrated circuits are protected, but mold flash or bleed contamination impedes reliable attachments
Solution Approach 1:
The patent extracts or removes the harmful mold flash contamination from the assembly area by carefully controlling the encapsulation process to prevent flash from reaching the attachment regions. The encapsulation is performed in a way that isolates the integrated circuits for protection while preventing the generation of harmful flash that would impede subsequent attachment operations
4Quantity of substance
If substrate and integrated circuit are damaged during assembly or testing, then manufacturing complexity increases, but integrated circuit density benefit is lost
Solution Approach 1:
The patent performs preliminary testing of individual integrated circuits before assembly to identify known-good-die, ensuring that only verified circuits are mounted. This preliminary action prevents damage to substrates and circuits during assembly by avoiding the mounting of defective components, thereby maintaining high circuit density without increasing manufacturing complexity
Data Source
AI summary
An integrated circuit package-on-package system includes: mounting an integrated circuit package system having a mountable substrate over a package substrate; forming a package encapsulation having both a recess and an anti-mold flash feature over the package substrate and the integrated circuit package system including: forming the anti-mold flash feature having an extension width at the bottom of the recess, and partially exposing the mountable substrate in the recess with the anti-mold flash feature over mountable substrate; and mounting an integrated circuit device over the mountable substrate in the recess.