Package-on-Package RF Antenna Assembly With Aligned Waveguide Path
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Solution Overview
Problem
Existing semiconductor device packages face challenges in accommodating higher performance features and applications while maintaining enhanced performance without significant cost impact, particularly due to configuration constraints and increased product or system costs.
Innovation Solution
A package-on-package semiconductor device is designed with an integrated antenna sub-assembly, featuring a non-conductive antenna substrate, antenna substrate waveguide, and antenna structure, aligned with a waveguide through the package substrate, allowing for a low-loss RF signal path that avoids obstruction by device components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor device packages are used, then manufacturing costs are controlled, but performance is limited and cannot accommodate higher performance features
Solution Approach 1:
The patent implements a package-on-package architecture where a first semiconductor device package is mounted on the package substrate, and a second semiconductor device package is mounted on the first package. This nested configuration allows multiple functional layers to be stacked vertically, enabling higher performance features to be accommodated without increasing the device footprint, thus resolving the contradiction between performance enhancement and configuration constraints.
Solution Approach 2:
The patent transitions from a planar two-dimensional package layout to a three-dimensional stacked configuration by mounting the second package on top of the first package. This vertical stacking approach utilizes the third dimension (height) to accommodate additional high-performance components, thereby enabling enhanced performance features without expanding the horizontal device area and maintaining cost-effectiveness.
2Reliability
If sophisticated semiconductor devices with specific application features are included, then performance is enhanced, but package configuration becomes constrained and costs increase
Solution Approach 1:
The patent divides the semiconductor device system into multiple independent functional packages, where each package can be optimized for specific application features. The first package and second package are separate modular units that can be independently designed, manufactured, and tested. This segmentation allows sophisticated features to be incorporated in each module without complicating the overall package configuration, as each package maintains its own optimized structure.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for mounting both the first and second semiconductor device packages, establishes electrical connections between packages through conductive vias, and enables signal routing between different functional layers. This multi-functional design allows the same package substrate structure to accommodate sophisticated features without increasing device complexity.
3Adaptability or versatility
If higher performance features are accommodated, then application capabilities are improved, but manufacturing costs increase significantly
Solution Approach 1:
The patent performs preliminary packaging and testing of individual semiconductor devices before mounting them in the final package-on-package configuration. Each semiconductor device package is independently packaged and validated prior to assembly, which allows for standardized manufacturing processes and reduces rework costs. This preliminary action enables higher performance features to be accommodated while controlling manufacturing costs through modular assembly.
Solution Approach 2:
The package substrate incorporates integrated waveguide structures and conductive vias that automatically establish electrical and signal connections between the first and second packages during the mounting process. This self-aligning, self-connecting design reduces the need for complex external interconnection structures and manual assembly steps, thereby enabling sophisticated application capabilities without significantly increasing manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated antenna configuration enables efficient RF signal transmission with reduced loss, maintaining performance while minimizing additional costs through optimized signal routing and component alignment.
Implementation Method 1
an antenna substrate waveguide aligned with a waveguide through the package substrate
Data Source
AI summary
A method of forming a package-on-package semiconductor device is provided. The method includes mounting an antenna sub-assembly on a first major side of a package substrate and a packaged RF semiconductor device on a second major side of the package substrate. The antenna sub-assembly includes an antenna substrate, an antenna substrate waveguide, and an antenna structure. The antenna substrate waveguide is aligned with a waveguide formed through the package substrate. The packaged RF semiconductor device includes a semiconductor die, an RDL formed over an active side of the first semiconductor die, and a signal launcher formed from a conductive layer of the RDL. The signal launcher is configured for propagation of an RF signal through the waveguide formed through the package substrate and the antenna substrate waveguide.