Package-on-Package System Using Segmented Modules
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Solution Overview
Problem
Current multi-chip packages face challenges in miniaturization, integration, and reliability due to vertical stacking of semiconductor dies, which complicates manufacturing and increases costs, as a single defect can lead to complete package failure, and there is a need for a solution to assemble multi-layer package systems using pre-tested modules to enhance efficiency and performance.
Innovation Solution
A package-on-package system is developed, comprising a bottom package module, a central internal stacking module with a central interposer, a spacer, and a top package module with an interposer, all encapsulated with a penetrable material, allowing for pre-tested Known Good Packages (KGP) to increase manufacturing yield and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If vertically stacked semiconductor dies are used in multi-chip packages, then circuit density and integration are improved, but manufacturing complexity and failure risk increase
Solution Approach 1:
The invention divides the multi-chip package into separate module units, each containing a limited number of semiconductor dies (e.g., 2-4 dies per module). These modules are manufactured and tested independently, then assembled into the final package. This segmentation reduces manufacturing complexity by breaking down the complex vertical stacking process into manageable, repeatable units while maintaining high circuit density through the modular architecture.
Solution Approach 2:
The invention implements preliminary testing of individual semiconductor dies and module assemblies before final package completion. Known Good Die (KGD) and Known Good Module (KGM) identification processes are performed early in the manufacturing sequence, allowing defective components to be filtered out before they compromise the entire package. This preliminary action reduces failure risk and simplifies subsequent assembly operations.
2Quantity of substance
If vertically stacked semiconductor dies are used, then integration is improved, but reliability decreases due to single defect causing complete package failure
Solution Approach 1:
By organizing semiconductor dies into separate module units with individual encapsulation, the invention creates isolation barriers that prevent defect propagation. If one die or module fails, the failure is contained within that specific module rather than affecting the entire package. This segmentation maintains high system integration while improving reliability through fault isolation.
Solution Approach 2:
The invention implements preliminary testing and identification of Known Good Dies and Known Good Modules before final package assembly. This beforehand cushioning ensures that only verified functional components are integrated into the final package, preventing defective components from causing complete package failure and thereby improving overall reliability.
3Volume of moving object
If individual semiconductor dies are assembled vertically, then miniaturization is achieved, but manufacturing difficulty increases
Solution Approach 1:
The invention segments the vertical stacking process into modular assembly steps where standardized module units are combined. Each module contains pre-organized dies and interconnect structures that can be manufactured using conventional techniques, then assembled vertically with simplified alignment and bonding processes compared to direct die-to-die stacking.
Solution Approach 2:
The invention introduces module-level interposer structures and standardized interconnect interfaces as intermediaries between individual semiconductor dies. These intermediary components provide mechanical support, electrical interconnection, and alignment features that simplify the assembly process while enabling compact vertical integration.
4Productivity
If pre-tested modules are used, then manufacturing yield is improved, but device complexity increases
Solution Approach 1:
The invention segments the package into standardized module units that can be independently manufactured and tested. This segmentation enables parallel production of multiple modules, improving manufacturing yield through economies of scale and specialized testing procedures. The modular structure, while more complex than simple die stacking, provides clear interfaces and repeatable assembly processes that manage overall device complexity.
Data Source
AI summary
A package-on-package system includes: providing a bottom package module incorporating a bottom package substrate; attaching a central internal stacking module, incorporating a central interposer, on top of the bottom package module; placing a spacer on the top surface of the central internal stacking module; mounting a first top package module, incorporating a first top interposer with an opening, on the spacer; and enclosing at least portions of the bottom package module, the central internal stacking module, and the first top package module with an encapsulant.