PoP Thermal Interface Material in Encapsulation Cavity
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Solution Overview
Problem
The existing package on package (PoP) devices face challenges with heat dissipation due to encapsulation layers with low thermal conductivity, leading to overheating of integrated devices, and require a solution to effectively manage thermal interface materials (TIM) with low viscosity for controlled heat dissipation.
Innovation Solution
Incorporating a thermal interface material (TIM) with high thermal conductivity into cavities formed within the encapsulation layer, allowing it to flow and fill gaps between packages while being controlled to prevent electrical issues, using techniques like laser processing or photo-etching to create cavities over and around the die for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation layer is used to protect integrated device, then reliability is improved, but thermal conductivity deteriorates causing heat dissipation problems
Solution Approach 1:
The encapsulation layer is segmented by creating cavities within it, allowing the thermal interface material to be positioned strategically at the heat source rather than requiring the entire encapsulation layer to be replaced or modified. This segmentation enables localized thermal management while preserving the protective function of the encapsulation layer.
Solution Approach 2:
A thermal interface material is introduced as an intermediary substance between the integrated device and the cavity in the encapsulation layer. This mediator facilitates heat transfer from the die through the encapsulation layer, resolving the contradiction between protection and heat dissipation by adding a thermal conduction pathway without compromising the protective function.
2Temperature
If thermal interface material is applied to improve heat dissipation, then temperature control is improved, but manufacturing precision deteriorates due to low viscosity causing flow control issues
Solution Approach 1:
Cavities are pre-formed in the encapsulation layer before the thermal interface material is applied. This preliminary action creates predetermined containment structures that guide the TIM to its intended location, preventing uncontrolled flow and improving placement precision while maintaining the material's low viscosity for effective heat dissipation.
Solution Approach 2:
The cavity structure provides localized containment for the thermal interface material, allowing the TIM to have different effective properties in different locations - contained and controlled at the application site, and free-flowing for heat dissipation where needed. This local quality differentiation resolves the contradiction between control and heat transfer efficiency.
3Temperature
If TIM is allowed to flow freely to fill gaps, then heat dissipation is improved, but electrical issues arise from uncontrolled TIM placement
Solution Approach 1:
The uncontrolled space is segmented into defined cavities with specific boundaries, allowing the TIM to flow freely within the cavity for heat dissipation while preventing it from encroaching on electrical components. This segmentation creates physical barriers that protect electrical performance while maintaining thermal management effectiveness.
Solution Approach 2:
The physical state and placement parameters of the TIM are changed by confining it within cavity boundaries. This parameter control allows the TIM to maintain its fluid-like heat transfer properties while its spatial distribution is controlled, preventing electrical issues caused by uncontrolled placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, reduces package warpage, and ensures reliable operation by effectively managing the thermal interface material, achieving lower maximum die temperatures and improved structural integrity.
Implementation Method 1
The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package
Implementation Method 2
The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer
Data Source
AI summary
A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.