Shingled Stacked Die Modules With Porch Interconnects
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Solution Overview
Problem
Semiconductor manufacturers face challenges in reducing the size and cost of semiconductor die packages due to the high cost and complexity of stacking multiple dies using through-substrate vias (TSVs) and wire bonding techniques, which increase the risk of defective packages and prolonged manufacturing throughput.
Innovation Solution
The use of stacked die modules, where multiple semiconductor dies are operatively coupled through conductive structures and encapsulated with their own molding structures, allowing for individual testing and connection to external interconnects, reducing the need for spacer structures and film-on-wire (FOW) usage, and simplifying the bonding process by forming conductive structures that connect the dies to package bond pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If through-substrate vias (TSVs) are used to stack semiconductor dies, then the footprint of the package is reduced, but the manufacturing cost increases
Solution Approach 1:
The patent divides the package into multiple stacked die modules, where each module contains one or more semiconductor dies mounted on a module substrate. This segmentation allows each module to be manufactured and tested independently, reducing the overall manufacturing complexity and cost compared to using TSVs for the entire package structure.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional stacking by vertically arranging multiple die modules. This dimensional change reduces the package footprint while avoiding the high manufacturing costs of TSV technology by using simpler interconnect methods at the module level.
2Reliability
If wire bonding is performed one at a time to connect semiconductor dies, then electrical connections are established, but the manufacturing throughput time increases
Solution Approach 1:
The patent combines multiple semiconductor dies into a stacked die module where the dies are electrically interconnected through conductive structures formed as integrated components rather than individual wire bonds. This merging of connection operations into a single manufacturing step significantly improves throughput while maintaining reliable electrical connections.
Solution Approach 2:
The conductive structures are formed preliminarily during the module fabrication process, before the modules are stacked and finalized. This preliminary formation of interconnects eliminates the need for time-consuming post-assembly wire bonding operations.
3Adaptability or versatility
If TSV technology is used to stack semiconductor dies, then die stacking is facilitated, but the manufacturing cost increases
Solution Approach 1:
The patent introduces module substrates as intermediary components between stacked semiconductor dies. These substrates provide mechanical support and electrical interconnection without requiring TSV technology, thus enabling die stacking while reducing manufacturing costs through simpler fabrication processes.
Solution Approach 2:
The patent creates standardized die module units that can be replicated and stacked. Each module is a self-contained unit with pre-formed conductive structures, allowing for mass production and consistent performance without the high costs associated with TSV-based stacking.
Data Source
AI summary
Stacked die modules for semiconductor device assemblies and methods of manufacturing the modules are disclosed. In some embodiments, the module includes a shingled stack of semiconductor dies, each die having an uncovered porch with bond pads. Further, a dielectric structure partially encapsulates the shingled stack of semiconductor dies. The dielectric structure includes openings corresponding to the bond pads. The module also includes conductive structures disposed on the dielectric structure, where each of the conductive structures extends over at least one porch of the semiconductor dies to connect to at least one bond pad through a corresponding opening. The semiconductor device assembly may include a controller die attached to a package substrate, the controller die carrying one or more stacked die modules, and bonding wires connecting terminals of the modules to package bond pads.