Porous Adhesive Composite for Damage-Free Substrate Release
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Solution Overview
Problem
Conventional adhesives fail to provide sufficient thermal and chemical resistance for electronic manufacturing processes, particularly for thin substrates, and are inadequate for easy and damage-free separation of work units from carrier substrates, often causing deformation or perforation due to outgassing at elevated temperatures.
Innovation Solution
A porous adhesive composite with tunable porosity, achieved by adjusting the ratio of filler to binder, allows for liquid capillary penetration to release substrates without harm, using a mixture of polymer resins and fillers that can withstand mechanical and thermal stresses during manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesives are used to affix work units to carrier substrates, then sufficient adhesive force is achieved to withstand manufacturing processes, but the adhesives cause deformation or perforation of thin substrates during removal due to outgassing at elevated temperatures
Solution Approach 1:
The patent applies porous materials by formulating the adhesive with a controlled porosity of 30-70% using filler particles (such as silica, alumina, or titania) dispersed in the polymer matrix. This porous structure allows liquids to penetrate through the adhesive layer during removal, capillary-wise displacing the adhesive and enabling clean substrate separation without the need for high-temperature outgassing that causes deformation or perforation.
Solution Approach 2:
The patent changes the physical and chemical parameters of the adhesive by controlling the filler-to-binder ratio (0.4 to 2.0 by weight), adjusting porosity (30-70%), and selecting specific polymer resins with appropriate glass transition temperatures. These parameter changes enable the adhesive to maintain strong bonding during manufacturing while allowing liquid penetration for clean removal, resolving the contradiction between bond strength and removal safety.
2Temperature
If adhesives with high thermal resistance are used to withstand manufacturing processes up to 250 C, then thermal stability is improved, but removal methods become complex and costly
Solution Approach 1:
The porous adhesive structure enables simple liquid penetration removal while maintaining thermal resistance up to 250°C during manufacturing. The filler particles (silica, alumina, titania) provide thermal stability, while the porous network allows liquid to capillary-wise displace the adhesive during removal, eliminating the need for complex high-temperature outgassing procedures and reducing both time and cost.
Solution Approach 2:
The patent introduces liquid as an intermediary substance that penetrates the porous adhesive structure during removal. This liquid mediator capillary-wise displaces the adhesive between the work unit and carrier substrate, enabling simple and efficient separation without requiring complex thermal or mechanical removal methods, thus reducing process complexity and cost.
3Ease of operation
If the adhesive porosity is increased to enable liquid penetration for easy removal, then ease of separation is improved, but adhesive force may be reduced
Solution Approach 1:
The patent optimizes the porous structure with 30-70% porosity, achieved by controlling the filler-to-binder ratio and particle packing. This controlled porosity provides sufficient liquid penetration pathways for easy removal while maintaining adequate adhesive force through the polymer matrix and filler-adhesive interactions, resolving the contradiction between ease of separation and bond strength.
Solution Approach 2:
The patent uses composite materials combining polymer resins (such as polyurethane, epoxy, or acrylic) with inorganic filler particles (silica, alumina, titania). This composite structure provides both the mechanical strength for adequate adhesive force and the porous network for liquid penetration, enabling simultaneous achievement of strong bonding and easy removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive effectively supports manufacturing processes with thermal resistance up to 250 C, enabling easy and rapid release of substrates without damage, reducing the complexity and cost associated with existing removal methods.
Implementation Method 1
liquid capillary penetration to release substrates without harm
Implementation Method 2
satisfy their mechanical and thermal demands
Implementation Method 3
thermal resistance up to 250 C
Data Source
AI summary
Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.