Porous Bonding Layer Cooling for Compact Power Assemblies
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Solution Overview
Problem
Conventional power device assemblies face challenges in achieving efficient cooling while maintaining a small volume profile, leading to thermal management issues and mechanical failures due to high temperature fatigue and coefficient of thermal expansion mismatches, especially in high-power, compact applications like electric vehicles.
Innovation Solution
The integration of porous bonding layers with embedded vapor channels and cap layers that include liquid feed channels, allowing for direct cooling fluid delivery to heat-generating devices, which reduces the number of layers and provides improved thermal compliance and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling structures are used, then cooling efficiency is improved, but device volume increases
Solution Approach 1:
The bonding layer and cooling structure are merged into a single integrated component. The bonding layer contains embedded vapor channels that directly contact the heat-generating device, eliminating the need for separate cooling structures and reducing overall device volume while maintaining effective heat removal.
Solution Approach 2:
The vapor channels are nested within the bonding layer structure itself. The cooling channels are embedded inside the bonding material, creating a nested configuration where the cooling function is contained within the structural component, maximizing space utilization.
2Volume of stationary object
If the number of layers is reduced, then device volume decreases, but thermal management capability deteriorates
Solution Approach 1:
Multiple functions (bonding and cooling) are combined into the bonding layer, allowing reduced layer count while maintaining thermal management capability through the embedded vapor channels that provide direct heat removal pathways.
Solution Approach 2:
The bonding layer is designed with a porous structure containing vapor channels, enabling thermal management functionality to be integrated within the bonding material itself, thus maintaining cooling capability with fewer layers.
3Ease of manufacture
If conventional bonding layers are used, then device assembly is simplified, but thermal fatigue reliability deteriorates
Solution Approach 1:
The bonding layer and cooling structure are merged, creating a single component that performs both bonding and thermal management functions, simplifying assembly while the embedded vapor channels provide continuous thermal pathways that reduce thermal fatigue.
Solution Approach 2:
The bonding layer is designed as a composite structure with embedded vapor channels, combining the bonding function with thermal management functionality, improving reliability by providing dedicated heat removal pathways that reduce thermal stress and fatigue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal management by allowing direct cooling of heat-generating devices, reducing the package volume, and mitigating thermal fatigue, thereby improving the reliability and efficiency of power device assemblies in high-power, compact applications.
Implementation Method 1
one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels
Implementation Method 2
one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels
Implementation Method 3
one or more cap layers engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device, the one or more cap layers comprising a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device
Data Source
AI summary
A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.