Porous Capacitor Dicing Lines Defined by Etching Mask
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Solution Overview
Problem
The existing methods for forming three-dimensional capacitors in semiconductor products result in jagged and irregular edges during dicing, which degrade the mechanical properties of integrated devices, and the use of laser grooving to prevent this introduces additional process steps, costs, and potential damage to the underlying materials.
Innovation Solution
A method involving the formation of a metal barrier layer, anodization to create porous regions with straight pores, and etching the bottom ends of these pores to create a dicing line, using oxide plugs as anchoring points to prevent delamination and splintering, allowing for mechanical blade dicing without laser grooving.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical blade dicing is used to dice integrated devices, then productivity is improved, but the edges become jagged and irregular due to splintering of porous material
Solution Approach 1:
The patent applies preliminary action by performing laser grooving before mechanical blade dicing. The laser creates a groove along the dicing line that pre-fractures the material and guides the blade, preventing splintering and jagged edges during the subsequent mechanical dicing process
Solution Approach 2:
The laser grooving acts as an intermediary step between the porous structure formation and mechanical dicing. This intermediate process modifies the material structure along the dicing line, creating a controlled fracture path that eliminates the direct harmful interaction between the mechanical blade and porous material
2Manufacturing precision
If laser grooving is performed prior to mechanical blade dicing to prevent jagged edges, then edge quality is improved, but device complexity increases due to additional process steps
Solution Approach 1:
The patent replaces the mechanical dicing process with a laser-based system. Instead of using a mechanical blade that causes splintering, the laser performs both grooving and cutting, eliminating the need for sequential mechanical operations and reducing overall process complexity despite the advanced technology involved
3Manufacturing precision
If laser grooving is used to prevent splintering, then edge quality is improved, but the underlying materials are damaged due to laser heat
Solution Approach 1:
The patent applies local quality by concentrating the laser energy only along the specific dicing line path where grooving is needed, rather than applying heat broadly. This localized approach creates the necessary groove for clean cutting while minimizing thermal diffusion to surrounding materials and preventing collateral damage
4Quantity of substance
If porous structures are formed to increase capacitance density, then capacitance density is improved, but the structures become prone to splintering during dicing
Solution Approach 1:
The patent applies preliminary action by performing laser grooving before mechanical blade dicing. The laser creates a groove along the dicing line that pre-fractures the material and guides the blade, preventing splintering and jagged edges during the subsequent mechanical dicing process
Solution Approach 2:
The laser grooving acts as an intermediary step between the porous structure formation and mechanical dicing. This intermediate process modifies the material structure along the dicing line, creating a controlled fracture path that eliminates the direct harmful interaction between the mechanical blade and porous material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents the formation of jagged edges and splintered chips during dicing, reducing process complexity and costs, while ensuring clean dicing lines and maintaining the mechanical integrity of the devices.
Implementation Method 1
anodizing a first region and a second region of the anodizable metal layer to obtain respectively a first porous region and a second porous region both comprising a plurality of substantially straight pores that extend from a top surface of the porous region, perpendicularly to the top surface of the porous region, towards the metal barrier layer
Implementation Method 2
etching the bottom ends of pores of the second porous region through the opening of the etching mask to obtain pores that form a device region, and pores in the first porous region that form a dicing line
Data Source
AI summary
A method for obtaining an integrated device that includes: forming a metal barrier layer above a substrate; forming an anodizable metal layer on the metal barrier layer; anodizing a first region and a second region of the anodizable metal layer to obtain respectively a first porous region and a second porous region both having a plurality of substantially straight pores that extend from a top surface of the porous region towards the metal barrier layer; forming an etching mask above at least the first porous region having an opening above the second porous region; and etching bottom ends of pores of the second porous region through the opening of the etching mask to obtain pores that form a device region, and pores in the first porous region that form a dicing line, the integrated device being delimited at least by the dicing line.