Porous-Layer Capacitor Through-Hole Structure for Low-Resistance Reliability
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Solution Overview
Problem
Existing capacitors face reliability issues due to high connection resistance and corrosion risks in the porous layers, particularly in printed wiring boards and solid electrolytic capacitors, which hinder improved performance.
Innovation Solution
A capacitor design with a through-hole conductor connected to the anode plate's end face, incorporating a porous layer and dielectric layer, and a cathode layer, where the through-hole conductor is metallized to reduce connection resistance and corrosion risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bulk aluminum substrate is used as the conductive path, then the structural strength is improved, but the connection resistance between the aluminum substrate and the connection layer increases
Solution Approach 1:
The patent applies a porous layer on the aluminum substrate surface to increase the connection area between the aluminum substrate and the connection layer. This porous structure provides more contact points for the connection layer, thereby reducing connection resistance while maintaining the structural strength of the bulk aluminum substrate.
2Reliability
If a porous layer is added to the aluminum substrate to reduce connection resistance, then the connection resistance is reduced, but the risk of corrosion from plating processes increases
Solution Approach 1:
The patent introduces a barrier layer as an intermediary between the porous layer and the plating process. This barrier layer protects the porous layer from direct exposure to corrosive plating chemicals, thereby reducing corrosion risk while maintaining the low connection resistance provided by the porous structure.
3Manufacturing precision
If the through-hole diameter is reduced to improve precision, then the manufacturing precision is improved, but the connection resistance between the through-hole conductor and the aluminum substrate increases
Solution Approach 1:
The patent uses the porous layer to compensate for the reduced through-hole diameter. The porous structure provides additional connection pathways and increased contact area between the through-hole conductor and the aluminum substrate, thereby maintaining low connection resistance even when the through-hole diameter is reduced for improved precision.
Data Source
AI summary
A capacitor that includes: a capacitor layer including a capacitor part, the capacitor part having a first through-hole extending through the capacitor part in the thickness direction and defining an inner wall surface, the capacitor part including: an anode plate including a core part and a porous layer, a dielectric layer, and a cathode layer; and a first through-hole conductor disposed at least on the inner wall surface of the first through-hole, wherein the first through-hole conductor is electrically connected to an end face of the anode plate that faces the inner wall surface of the first through-hole in a plane direction, which is a direction of a plane perpendicular to the thickness direction, and the first void contains at least part of the first through-hole conductor.