Porous Capacitor Component for Ultra-High Capacitance
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Solution Overview
Problem
Existing capacitor technologies face challenges in achieving ultra-high capacitance while maintaining thinness, especially in portable IT products, due to the complexity of semiconductor processes and difficulties in forming dielectrics within trenches that satisfy breakdown voltage conditions.
Innovation Solution
A capacitor component design featuring a porous capacitor portion with a conductive or insulating porous body, a dielectric layer, and an electrode layer, which increases surface area without requiring complex semiconductor processes, using a ceramic substrate and multilayer structures to enhance capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a trench type capacitor is used to increase capacitance by increasing surface areas of electrodes, then capacitance is improved, but device complexity increases due to requiring relatively complicated semiconductor process technology
Solution Approach 1:
The patent employs a porous body structure where a porous layer is formed on the substrate, and electrodes are deposited within the pores. This porous structure dramatically increases the surface area of the electrodes without requiring complex trench formation processes, thereby achieving high capacitance while simplifying the manufacturing process
Solution Approach 2:
The invention transitions from a planar electrode structure to a three-dimensional porous structure. By utilizing the vertical dimension and creating a porous network, the electrode surface area is exponentially increased without proportionally increasing the footprint or process complexity, effectively resolving the contradiction between capacitance and process simplicity
2Quantity of substance
If a trench type capacitor is used to increase capacitance, then capacitance is improved, but ease of manufacture deteriorates due to difficulty in forming a plurality of dielectrics in the trench when considering thickness of dielectric material satisfying breakdown voltage conditions
Solution Approach 1:
The porous layer provides a naturally high-surface-area structure that eliminates the need for forming multiple dielectric layers within trenches. The porous structure itself can serve as the dielectric medium, or electrodes can be deposited within the pores, simplifying the manufacturing process while maintaining high capacitance
Solution Approach 2:
The invention extracts the complex multi-layer dielectric formation process from the capacitor structure. Instead of forming multiple dielectric layers within trenches, the design uses a single porous layer where electrodes are deposited within the pores, thereby taking out the complexity of forming multiple dielectrics while preserving the high capacitance function
3Length of stationary object
If thin film capacitor technology is used to reduce thickness, then thickness is reduced, but capacitance density decreases compared to traditional capacitors
Solution Approach 1:
The porous structure allows the capacitor to maintain a thin overall profile while providing an exponentially larger electrode surface area within that thin profile. The pores provide vertical surface area without increasing the horizontal footprint or overall thickness, thereby achieving both thinness and high capacitance simultaneously
Solution Approach 2:
The electrode structure is nested within the porous layer, with electrodes deposited inside the pores of the porous structure. This nested arrangement allows the capacitor to achieve high surface area and capacitance within a compact, thin form factor, as the electrodes are embedded within the three-dimensional porous network rather than requiring additional vertical space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design efficiently achieves ultra-high capacitance with increased surface area, simplifying the manufacturing process and outperforming trench type capacitors in capacitance, while maintaining a thin form factor suitable for portable electronics.
Implementation Method 1
a porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes. The porous capacitor portion may include a porous body
Data Source
AI summary
A capacitor component includes a body, and first and second external electrodes formed on external surfaces of the body. The body includes a first connection electrode connected to the first external electrode, a second connection electrode disposed on the first connection electrode to partially cover the first connection electrode and connected to the second external electrode, and a porous capacitor portion disposed to cover the first and second connection electrodes and connected to each of the first and second connection electrodes.