Porous Ceramic Layer for Chip Heat Dissipation and Insulation
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Solution Overview
Problem
Current chip packaging technologies face challenges in efficiently dissipating heat and achieving precise electrical insulation between semiconductor chips and leadframes, leading to high processing costs and complex processes.
Innovation Solution
A chip arrangement involving a carrier with a first chip electrically connected to it, a ceramic layer with porosity ranging from 3% to 70% disposed over the carrier, and a second chip positioned over the ceramic layer, utilizing a plasma dust method for particle deposition to enhance heat dissipation and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrically insulating materials (e.g., electrically insulating glue) are used for chip adhesion, then electrical insulation between chips and leadframe is achieved, but heat dissipation capability is insufficient
Solution Approach 1:
The patent employs a composite ceramic layer combining electrically insulating materials (glass, epoxy, or plastic) with thermally conductive ceramic particles (aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, silicon carbide, titanium oxide, titanium nitride, zirconium oxide, boron nitride, or boron carbide). This composite structure simultaneously provides electrical insulation through the matrix material and heat dissipation through the thermally conductive particles, resolving the contradiction between insulation and heat dissipation.
Solution Approach 2:
The patent controls the porosity of the ceramic layer within a specific range (3% to 70%) to optimize both electrical insulation and thermal conductivity. By adjusting the porosity parameter, the balance between insulation performance and heat dissipation capability is optimized, as lower porosity generally improves thermal conductivity while maintaining electrical insulation properties.
2Reliability
If double soft soldering process is used for DCB realization, then reliable electrical connections are achieved, but processing costs and process complexity increase significantly
Solution Approach 1:
The patent extracts and eliminates the complex double soft soldering process from the manufacturing sequence by using a ceramic layer that can be directly formed and bonded to the leadframe. The ceramic layer serves both as an insulating barrier and as a bonding substrate, removing the need for separate soldering operations and significantly simplifying the manufacturing process.
Solution Approach 2:
The patent merges the functions of electrical insulation, heat dissipation, and mechanical bonding into a single ceramic layer structure. This integrated approach combines multiple functions that were previously achieved through separate components and processes, reducing overall manufacturing complexity and cost while maintaining reliability.
3Loss of energy
If conventional ceramic processes are used, then sufficient heat dissipation is achieved, but design modifications for different chip dimensions are lengthy and expensive
Solution Approach 1:
The patent introduces flexibility and adaptability into the ceramic layer design by allowing easy modification of layer thickness, porosity, and particle distribution according to different chip dimensions and thermal requirements. The ceramic layer can be dynamically adjusted in its structural parameters to match various design needs without requiring complete process retooling, enabling rapid design iterations and cost-effective customization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively insulates and dissipates heat while reducing processing costs and simplifying the manufacturing process, allowing for precise placement of isolation layers and flexible material adaptation.
Implementation Method 1
utilizing a plasma dust method for particle deposition
Implementation Method 2
the ceramic layer has a porosity in the range from about 3% to about 70%
Data Source
AI summary
A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.