Porous Frame Member for Void-Suppressing Module-to-Heat-Sink Insulation
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Solution Overview
Problem
The existing semiconductor devices with thermally conductive insulating resin sheets between power modules and heat sinks face issues with insufficient compression, leading to unsuppressed voids which compromise insulation performance.
Innovation Solution
A semiconductor device design incorporating a frame member with a porous material surrounding the insulating resin layer, which is compressed between the semiconductor module and heat sink, allowing the resin to fill the pores and effectively suppress voids, thereby enhancing insulation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thermally conductive insulating resin sheet is pressurized to suppress voids, then insulation performance is improved, but the resin flows to surrounding portions causing pressure decrease and insufficient compression
Solution Approach 1:
The frame member is made of porous material that allows the insulating resin to penetrate during compression. This porous structure enables the resin to be absorbed into the frame member rather than flowing to surrounding portions, maintaining compression pressure while suppressing voids in the insulating resin layer.
Solution Approach 2:
The frame member acts as an intermediary component between the insulating resin sheet and the heat sink. It provides a controlled path for resin penetration and maintains uniform compression pressure distribution, preventing resin from flowing to unwanted surrounding areas while ensuring sufficient void suppression.
2Manufacturing precision
If a convex material (sheet thickness regulating member) is used to support the pressing portion, then thickness control is achieved, but the insulating resin sheet is no longer compressed and voids are not suppressed
Solution Approach 1:
The frame member made of porous material is compressed between the insulating resin sheet and heat sink during assembly. This compression forces the insulating resin into the pores of the frame member, effectively suppressing voids while the frame member itself maintains the thickness regulation function.
Solution Approach 2:
The frame member combines multiple functions: it acts as both a thickness regulating member and a compression medium. By merging the thickness control function with the void suppression function in a single component, the patent eliminates the need for separate convex supporting materials that would prevent compression.
3Reliability
If the insulating resin layer is sufficiently pressurized to suppress voids, then insulation performance improves, but device complexity increases
Solution Approach 1:
The frame member serves multiple functions simultaneously: it provides structural support, regulates thickness, enables compression of the insulating resin, and absorbs excess resin during pressing. This multi-functionality eliminates the need for additional components, maintaining device simplicity while achieving sufficient void suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures sufficient pressurization of the insulating resin layer, effectively suppressing voids and improving insulation performance while maintaining heat dissipation properties.
Implementation Method 1
The first resin enters pores of the porous material
Implementation Method 2
The frame member is compressed while being sandwiched between the semiconductor module and the heat sink
Implementation Method 3
heat sink and the semiconductor module sandwich the insulating resin layer and the frame member
Data Source
AI summary
A semiconductor device includes a semiconductor module, an insulating resin layer, a frame member, and a heat sink. Insulating resin layer is bonded to semiconductor module and contains a first resin. Frame member is disposed to surround insulating resin layer, and includes a porous material. Heat sink and semiconductor module sandwich insulating resin layer and frame member. Frame member is compressed while being sandwiched between semiconductor module and heat sink. Insulating resin layer is filled in a region surrounded by semiconductor module, heat sink, and frame member. The first resin enters pores of the porous material.