Porous Frit for OLED Encapsulation Impact Resistance
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Solution Overview
Problem
Organic light emitting diode (OLED) display devices face challenges with mechanical strength due to the vulnerability of frits to external impact and adhesion issues between substrates, as conventional desiccants complicate processes, increase costs, and reduce durability in mass production.
Innovation Solution
Incorporating a frit with a plurality of pores between the substrates to absorb external impact and improve adhesion, formed from materials like MgO, CaO, and SiO2, with a porosity of 5-95% and pore sizes of 0.2-10 μm, which also prevents moisture permeation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional frit is used to encapsulate the OLED, then the encapsulation characteristic is excellent with very low permeability, but the frit has poor flexibility and malleability making it very vulnerable when deformed by external impact
Solution Approach 1:
The frit is designed with a porous structure containing multiple voids or pores distributed throughout its matrix. These pores act as cushioning spaces that can compress and deform under external impact, absorbing mechanical stress and preventing crack propagation. The porous structure maintains the low permeability characteristic while significantly improving flexibility and impact resistance.
Solution Approach 2:
The frit incorporates a cushioning layer or cushioning material between the upper and lower substrates. This cushioning structure is pre-positioned to absorb external impacts before they can reach and damage the OLED. The cushioning layer deforms under impact forces, protecting the brittle frit and underlying OLED from mechanical damage.
2Reliability
If a powder-type desiccant is used to protect the OLED, then moisture protection is improved, but the process becomes complicated and production costs increase
Solution Approach 1:
The desiccant function is merged with the frit structure. The frit itself is designed to possess moisture-absorbing capabilities, eliminating the need for a separate desiccant layer. This integration maintains effective moisture protection while simplifying the overall device structure and reducing manufacturing process complexity.
Solution Approach 2:
The frit is designed to perform multiple functions simultaneously: encapsulation with low permeability, mechanical cushioning through porous structure, and moisture absorption through integrated desiccant properties. This multi-functional design eliminates the need for separate desiccant components and simplifies the device architecture.
3Strength
If the frit is exposed to external impact, then a crack may be generated in the frit causing damage, but adding cushioning structures increases device complexity
Solution Approach 1:
The frit adopts a porous structure with distributed voids that inherently provide cushioning capabilities. This internal porous architecture absorbs impact energy through pore compression and deformation, providing crack resistance without requiring additional external cushioning layers. The cushioning function is built into the frit material itself, maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The porous frit enhances mechanical strength and adhesion between substrates, effectively protecting OLEDs from external impacts and maintaining durability while preventing moisture ingress.
Implementation Method 1
the frit includes a plurality of pores... to absorb external impact
Implementation Method 2
a frit having an excellent encapsulation characteristic due to very low permeability
Data Source
AI summary
An organic light emitting diode display device having a frit which can improve mechanical strength and adhesion between the upper substrate and the lower substrate, and a method of fabricating the same are disclosed. The organic light emitting diode display device includes a lower substrate, an organic light emitting diode disposed on the lower substrate, an upper substrate to be coupled to the lower substrate, and a frit disposed between the lower substrate and the upper substrate to couple both the lower substrate and the upper substrate to each other where the frit has a plurality of pores.