Porous Acoustic Layer Laser Drilling for Faster Hole Formation

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Solution Overview

Problem

Current methods for manufacturing porous layers for sound absorption structures are time-consuming, requiring extensive mechanical drilling or laser ablation with multiple passes, which prolongs the production process.

Innovation Solution

A process using a laser beam with optimized parameters to create through holes in a porous layer with a low number of passes, reducing manufacturing time while maintaining structural integrity and aerodynamic performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If mechanical drilling or laser ablation with multiple passes is used to create through holes in the porous layer, then the holes can be formed with required precision, but the manufacturing time is significantly prolonged

Engineering Contradiction:
Improvehole diameter precisionVSAvoidmanufacturing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent changes the laser processing parameters by using a single-pass laser drilling method with optimized laser power, pulse duration, and scanning speed parameters. This allows the laser to create precise through-holes in one pass rather than requiring multiple passes, thereby reducing manufacturing time while maintaining hole diameter precision. The key parameter change is transitioning from low-power multi-pass mode to optimized high-power single-pass mode.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the number of through holes is increased to achieve high open surface rate, then the sound absorption performance is improved, but the manufacturing complexity and time increase

Engineering Contradiction:
Improvesound absorption performanceVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical drilling system with a laser-based ablation system that can rapidly create multiple through-holes without mechanical contact. The laser beam can be quickly repositioned and focused to create precise holes at different locations, enabling high open surface rates without the mechanical complexity and time constraints of traditional drilling methods. This substitution allows for faster, more flexible hole creation across the porous layer surface.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces production time for porous layers while maintaining effective sound absorption and minimizing drag, achieving a higher open surface ratio with fewer holes, thus optimizing acoustic treatment and aerodynamic performance.

Implementation Method 1

making holes 42 in solid layer 56 using a laser beam 58

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

the holes 38 are made by ablation using a laser beam

Methodology Applied
Scientific EffectAblation: Ablation

Data Source

PatentEP3723081B1Method for manufacturing a porous layer of an acoustic absorption structure, porous layer of an acoustic absorption structure thus obtained and acoustic absorption structure including said porous layer
Publication Date: 2023.05.03 AIRBUS OPERATIONS (SAS)
  • EP3723081B1 patent drawingFigure 1~3
  • EP3723081B1 patent drawingFigure 4~6
  • EP3723081B1 patent drawingFigure 7~9

AI summary

The invention relates to a method for manufacturing a porous layer of an acoustic absorption structure comprising a first step of producing a solid layer having at least one structural frame (44) embedded in a resin matrix (46) and having first and second reinforcing bands arranged so as to delimit areas without reinforcing bands (50) and a second step of producing through holes (42) at the level of the areas without reinforcing bands (50) of the solid layer using a laser beam (58).