Porous Material Pore Sealing via Solid Fluid Phase Transition
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Solution Overview
Problem
Porous substrates, particularly low-k dielectrics, suffer damage during plasma treatments due to penetration of active plasma radicals, leading to changes in composition and mechanical instability, with existing sealing methods being complex, labor-intensive, and potentially leaving residues or altering dielectric constants.
Innovation Solution
A method involving setting the temperature and pressure to solidify a fluid within the pores of the porous material, followed by treatment, and then vaporizing the fluid to seal and protect the surface from damage, effectively preventing plasma-induced damage during etching or modification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a liquid polymer solution is applied to seal porous material, then the pores are sealed, but the liquid solvent can penetrate deeply into the porous material and remain entrapped, changing the dielectric constant
Solution Approach 1:
The patent applies a polymer in solid form directly to the porous material surface. The solid polymer particles penetrate and fill the pores without requiring a liquid solvent, thus sealing the pores while avoiding solvent entrapment that would alter the dielectric constant. The solid state ensures complete evaporation/ removal without residual liquid phases.
Solution Approach 2:
The invention changes the physical state parameter of the polymer from liquid solution to solid form. This parameter change eliminates the solvent component entirely, allowing the polymer to seal pores through solid particle deposition and subsequent sintering or bonding, without introducing liquid that could be trapped and alter material properties.
2Reliability
If a polymer sealing method is used, then the pores are sealed, but the method is complicated and labor-intensive requiring synthesis, solution preparation, homogeneous application, and heating
Solution Approach 1:
The invention extracts and removes the complex steps of polymer synthesis, solution preparation, and controlled heating from the sealing process. By using pre-formed solid polymer particles that can be applied directly and removed by simple evaporation or rinsing, the method eliminates multiple complex工序 while maintaining sealing effectiveness.
Solution Approach 2:
The solid polymer acts as a temporary sealing agent that is easily removed after serving its protective function. The polymer particles are applied, provide sealing during plasma treatment, then completely evaporate or are rinsed away without requiring complex removal procedures, making the process simple and disposable.
3Reliability
If polymer is retained in the pores after treatment, then the pores are sealed, but it potentially influences the properties of the dielectrics making them harder to control
Solution Approach 1:
The solid polymer particles undergo complete phase transition to gas/vapor during the treatment process through evaporation or thermal decomposition. This ensures no polymer residue remains in the pores after treatment, maintaining the original dielectric properties and full controllability of the material characteristics.
4Ease of operation
If liquid solvent is used to apply polymer, then the polymer can be applied, but dissolution or damage of the porous layer is possible
Solution Approach 1:
The invention changes the application method from liquid solution to solid particle deposition. Solid polymer particles are applied directly to the surface without requiring liquid solvent, eliminating the risk of solvent-induced dissolution or damage to the porous substrate while maintaining effective pore sealing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method efficiently seals the pores of porous materials, preventing damage during plasma treatments and maintaining the integrity of low-k dielectrics, ensuring consistent dielectric properties and mechanical stability without the drawbacks of existing methods.
Implementation Method 1
contacting said surface with a fluid having a solidifying temperature at said pressure value P1 above said value T1, thereby solidifying said fluid in pores of said material
Implementation Method 2
Setting the temperature of said surface to a value T2 and setting the pressure of said environment to a value P2 in such a way as to vaporize said fluid
Data Source
Figure 1a~1f
Figure 2a~2f
Figure 3a~3f
AI summary
The invention relates to a method for treating a surface of a porous material in an environment, said method comprising the steps of: I. Setting the temperature of said surface to a value T1 and setting the pressure of said environment to a value P1, II. contacting said surface with a fluid having a solidifying temperature at said pressure value P1 above said value T1 and having a vaporizing temperature at said pressure value P1 below 80°C, thereby solidifying said fluid in pores of said material, thereby sealing said pores, III. treating said surface, wherein said treatment is preferably an etching or a modification of said surface, IV. Setting the temperature of said surface to a value T2 and setting the pressure of said environment to a value P2 in such a way as to vaporize said fluid,