Porous Metal Layer for Power Module Thermal Management
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Solution Overview
Problem
Electronic device manufacturers face challenges in achieving high thermal dissipation and mechanical robustness at low costs, particularly in the packaging of power modules, which affects performance and longevity.
Innovation Solution
A power module with a first main surface configured as a heat dissipating surface without electrical power terminal functionality, featuring a porous metal layer that is clamped to a heat sink with pressure equal to or more than 50 N/mm2, providing both mechanical and thermal benefits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging methods are used for power modules, then manufacturing cost is reduced, but heat dissipation capability and mechanical robustness are insufficient
Solution Approach 1:
A porous copper layer is applied to the heat dissipation surface of the power module package. This porous structure provides high thermal conductivity for effective heat dissipation while maintaining cost-effectiveness and compatibility with conventional manufacturing processes.
Solution Approach 2:
The packaging structure combines multiple materials including the porous copper layer, substrate material, and encapsulant to achieve optimal thermal management and mechanical properties. This composite approach allows customization of thermal conductivity and structural strength.
2Temperature
If higher clamping pressure is applied to improve thermal contact, then heat dissipation improves, but local pressure peaks cause mechanical damage to the module
Solution Approach 1:
The porous copper layer acts as a compliant interface material that distributes clamping pressure uniformly across the heat dissipation surface. The porous structure deforms under pressure to fill surface irregularities, preventing localized stress concentrations that would damage the module while maintaining excellent thermal contact.
Solution Approach 2:
The porous structure changes the mechanical parameters of the interface layer, providing both compliance for pressure distribution and high thermal conductivity for heat transfer. This allows higher overall clamping forces to be applied without creating damaging local pressure peaks.
3Adaptability or versatility
If the heat dissipating surface has electrical power terminal functionality, then device functionality is enhanced, but thermal dissipation efficiency is reduced
Solution Approach 1:
The package is designed with differentiated surface properties: one surface (the first main surface) is optimized for heat dissipation with high thermal conductivity and no electrical terminals, while other surfaces maintain electrical power terminal functionality. This spatial separation of functions allows each surface to be optimized for its specific purpose without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances thermal conductivity and mechanical robustness, preventing mechanical damage and allowing higher pressure application, thus improving the performance and lifespan of power modules.
Implementation Method 1
The first porous metal layer is arranged between the power module and the heat sink... allowing for higher clamping pressures and enhanced thermal conductivity
Implementation Method 2
A first porous metal layer is arranged on the portion of the first main surface... The first porous metal layer provides mechanical robustness and improved thermal dissipation by evenly distributing pressure
Data Source
AI summary
An electronic device comprises a power module comprising a first main surface and a second main surface opposite to the first main surface, wherein at least a portion of the first main surface is configured as a heat dissipating surface without electrical power terminal functionality. The electronic device comprises a porous metal layer arranged on the portion of the first main surface.