Porous Metallic Heat Dissipation Pattern for OLED Thermal Management
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Solution Overview
Problem
Organic light-emitting display devices face rapid deterioration due to heat generation from drivers and light-emissive elements, leading to compromised image quality and lifespan, as existing heat dissipation methods are inefficient.
Innovation Solution
A display device design featuring a porous framework layer made of intertwined metallic fibers with a heat emission layer composed of particles, positioned between the encapsulating structure and bottom cover, facilitating quick and efficient heat transfer and dissipation, along with a metal-reinforced encapsulating structure and a planar reinforcing plate to enhance heat transfer and device rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation methods are used, then device structure is simple, but heat dissipation efficiency is poor leading to rapid deterioration
Solution Approach 1:
The patent employs a porous framework layer made of intertwined metallic fibers as the core heat dissipation structure. The porous configuration increases the surface area for heat exchange while maintaining structural integrity, enabling efficient heat transfer from the light-emitting array through the encapsulating structure to the bottom cover, thereby improving device lifespan without excessive complexity
Solution Approach 2:
The heat dissipation structure combines multiple materials with complementary properties: metallic fibers provide thermal conductivity and structural framework, while particles coated on the framework enhance heat emission. This composite approach optimizes heat dissipation performance while managing the complexity through functional integration
2Temperature
If heat dissipation structure is added, then heat dissipation efficiency is improved, but device thickness increases
Solution Approach 1:
The encapsulating structure is designed as a thin film that integrates heat dissipation functionality. The porous framework layer and particle coating are applied as thin layers on the encapsulating structure, enabling effective heat dissipation without significantly increasing device thickness. The thin film approach maintains a compact form factor while achieving the desired thermal management performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution significantly improves heat dissipation, delaying deterioration and extending the lifespan of the display device while maintaining image quality by efficiently transferring heat from the encapsulating structure to the bottom cover through the heat dissipation pattern.
Implementation Method 1
the heat dissipation pattern receives the heat from the encapsulating structure and emits the heat around the heat dissipation pattern and the bottom cover
Implementation Method 2
a heat emission layer composed of particles coated on the framework layer, wherein the heat emission layer can emit the heat from the framework layer
Data Source
AI summary
A display device includes an encapsulating structure disposed on an array substrate, a bottom cover accommodating therein the array substrate and the encapsulating structure, and at least one heat dissipation pattern disposed between the encapsulating structure and the bottom cover. The heat dissipation pattern may include a porous framework layer and a heat emission layer composed of particles coated on the framework layer. This heat dissipation pattern may allow heat transfer from the encapsulating structure to the bottom cover to be performed more quickly and efficiently.