Porous Passivation Layer for TFT Array Corrosion Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The connection between a flexible printed circuit substrate and a thin film transistor substrate in liquid crystal displays experiences corrosion issues due to exposed metal areas, affecting the reliability of the thin film transistor array panel.
Innovation Solution
A thin film transistor array panel with a passivation layer having a porous structure is developed to minimize the exposed metal area at the connection portion, enhancing corrosion resistance by forming a passivation layer with inorganic and organic layers and using corrosion protecting layers made of metals like molybdenum-based, copper-based, or titanium-based metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional passivation layer is used to protect the connection portion, then corrosion resistance is improved, but the exposed metal area cannot be minimized
Solution Approach 1:
The passivation layer is designed with a porous structure containing multiple pores distributed throughout its thickness. This porous configuration allows the passivation layer to maintain adequate coverage over the connection portion while minimizing the overall exposed metal area, thereby improving corrosion resistance without excessive material usage.
Solution Approach 2:
The passivation layer is constructed as a composite structure combining multiple materials or layers with different properties. This composite approach enables the layer to provide effective corrosion protection while optimizing the exposed metal area through the synergistic properties of the constituent materials.
2Reliability
If the passivation layer is made thinner to reduce exposed metal area, then corrosion resistance is improved, but adhesive properties deteriorate
Solution Approach 1:
The porous structure of the passivation layer provides increased surface area and mechanical interlocking features that enhance adhesive properties. The pores allow for better bonding between the passivation layer and underlying layers, maintaining strong adhesion even when the layer thickness is reduced to minimize exposed metal area.
Solution Approach 2:
The invention optimizes parameters such as pore size, pore distribution, and layer composition to achieve the right balance between thickness, adhesion, and corrosion protection. By carefully controlling these parameters, the passivation layer maintains adequate adhesive strength while being thin enough to minimize exposed metal area.
Data Source
AI summary
A thin film transistor array panel includes a passivation layer formed on a plurality of end portions of a plurality of gate lines. A portion of the passivation layer has a porous structure formed between a connection portion of a flexible printed circuit substrate and a thin film transistor substrate such that when the flexible printed circuit substrate and the thin film transistor array panel are connected to each other, the passivation layer having a porous structure and which is formed at the connection portion therebetween connects the flexible printed circuit substrate with the thin film transistor array panel thereby minimizing an exposed area of the metal of the connection portion to improve a corrosion resistance thereof.