Porous Plug Substrate Support for Plasma Discharge Suppression
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Solution Overview
Problem
Abnormal discharge occurs in substrate supports during plasma processing due to potential differences, leading to consumption of electrostatic chucks and discharge marks on substrates, which existing technologies have not adequately addressed.
Innovation Solution
The substrate support incorporates detachable upper and lower porous plugs with fluid particles, such as Si-containing or resinous materials, in the through-holes to shorten electron paths and suppress abnormal discharge, and a regenerative method to replace used particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate support is used during plasma processing, then substrate processing is enabled, but abnormal discharge occurs due to potential differences
Solution Approach 1:
The patent introduces an intermediary substance (liquid or gel filling the through-hole) that acts as a mediator between the upper and lower electrodes. This intermediary has high dielectric strength and suppresses electron movement, thereby preventing abnormal discharge while allowing the substrate support to function normally during plasma processing
Solution Approach 2:
The patent changes the physical and electrical parameters within the through-hole by filling it with a liquid or gel substance. This substance has different dielectric properties compared to air or vacuum, thereby altering the electrical field distribution and suppressing abnormal discharge through parameter modification
2Reliability
If electrostatic chuck is used to hold substrate, then substrate positioning is achieved, but electrostatic chuck is consumed over time
Solution Approach 1:
The patent converts the harmful effect of electrical discharge into a beneficial protective mechanism. The liquid or gel filling the through-hole experiences electrical stress first, absorbing the harmful effects of abnormal discharge and protecting the electrostatic chuck from damage, thereby extending its service life
3Ease of operation
If through-hole is provided in substrate support, then gas flow path is enabled, but abnormal discharge occurs in the through-hole
Solution Approach 1:
The patent creates an inert electrical environment within the through-hole by filling it with a liquid or gel that has high dielectric strength. This inert environment suppresses electrical discharge while maintaining gas flow capability, thereby preventing discharge marks on the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses abnormal discharge, prevents electrostatic chuck consumption, and maintains substrate quality by regenerating the support structure.
Implementation Method 1
a plurality of fluid particles filling a space between the upper porous plug and the lower porous plug in the through-hole. Each of the plurality of fluid particles is formed of (i) an Si-containing material or (ii) a resinous material and an Si-containing coating on the resinous material
Data Source
AI summary
A substrate support includes a main body portion having a substrate supporting surface and a back surface opposite to the substrate supporting surface, the main body portion having a through-hole extending from the back surface to the substrate supporting surface, an upper porous plug and a lower porous plug disposed in the through-hole, at least one of the upper porous plug or the lower porous plug being detachable from the main body, and a plurality of fluid particles filling a space between the upper porous plug and the lower porous plug in the through-hole. Each of the plurality of fluid particles is formed of an Si-containing material or a resinous material and an Si-containing coating on the resinous material.