Porous Polyimide Aerogel Substrate for Microelectronics
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Solution Overview
Problem
Conventional interposers face challenges in providing both high thermal and mechanical performance while preventing warpage and crack propagation in microelectronic packages, with silica-based aerogels being fragile and losing insulation properties over time.
Innovation Solution
A substrate structure incorporating a porous polyimide aerogel with embedded electrodes, which offers high thermal conductivity, mechanical strength, and the ability to blunt stress fields, suppressing crack propagation, and is flexible without shedding dust or degrading insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If silica-based aerogel is used for thermal insulation, then thermal insulation performance is improved, but mechanical strength and reliability deteriorate due to fragility and dust shedding
Solution Approach 1:
The patent uses a composite structure combining polyimide matrix with aerogel particles or fibers. The polyimide provides mechanical strength and flexibility while the aerogel provides thermal insulation, creating a composite material that achieves both thermal performance and mechanical reliability.
Solution Approach 2:
The patent employs porous polyimide material with controlled porosity to achieve thermal insulation. The porous structure provides air pockets for thermal insulation while the polyimide matrix maintains mechanical integrity and prevents dust shedding, eliminating the need for fragile silica-based aerogels.
2Ease of manufacture
If conventional interposer materials are used, then manufacturing process is simple, but warpage control and crack propagation suppression deteriorate
Solution Approach 1:
The patent modifies the physical and chemical parameters of the polyimide material, including porosity, density, and cross-linking degree, to optimize both mechanical properties for warpage control and electrical properties for signal integrity, while maintaining compatibility with conventional manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The porous polyimide aerogel provides enhanced thermal and mechanical performance, improves package reliability by suppressing stress fields and crack propagation, and maintains insulation properties, leading to improved yield and reliability in microelectronic packages.
Implementation Method 1
interposers should have good mechanical and thermal characteristics in order to both thermally insulate between devices mounted on the interposer
Implementation Method 2
the ability to blunt stress fields and suppress crack propagation
Data Source
AI summary
A substrate structure is presented that can include a porous polyimide material and electrodes formed in the porous polyimide material. In some examples, a method of forming a substrate can include depositing a barrier layer on a substrate; depositing a resist over the barrier layer; patterning and etching the resist; forming electrodes; removing the resist; depositing a porous polyimide aerogel; depositing a dielectric layer over the aerogel material; polishing a top side of the interposer to expose the electrodes; and removing the substrate from the bottom side of the interposer.