Porous Resin Composition for Electrophotographic Fixing
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Solution Overview
Problem
Porous films used in electrophotographic image fixing apparatuses have poor mechanical strength and thermal conductivity issues, limiting their application in high-speed and mass printing due to inadequate control over porosity size and distribution, leading to inefficient heat insulation and mechanical resistance.
Innovation Solution
A resin composition with an engineering plastic-based porous structure, where over 80% of the porosity consists of independent porosities with a mean size between 0.01 μm and 0.9 μm, and a porosity ratio within ±30% of the mean, is used to enhance mechanical and heat insulation properties, and a lamination film with a releasing layer or substrate is applied to the electrophotographic transfer member or fixing member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the porosity ratio is increased to enhance heat insulation properties, then thermal insulation performance is improved, but mechanical strength deteriorates
Solution Approach 1:
The patent applies porous materials by creating a controlled porous structure within the polyimide resin. The porous layer contains numerous small pores with a total porosity ratio of 10-50%, which provides effective heat insulation while the pores are distributed throughout the matrix structure to maintain mechanical integrity. This resolves the contradiction by demonstrating that porous structures can provide thermal insulation without necessarily sacrificing mechanical strength when properly controlled.
Solution Approach 2:
The patent applies local quality by creating a porous layer with specific porosity characteristics in a particular region of the belt, rather than making the entire belt porous. The porous layer is positioned between the support layer and the surface layer, allowing heat insulation properties to be enhanced locally where needed while maintaining the overall structural strength of the belt through the non-porous support and surface layers.
2Ease of manufacture
If the porosity size is not controlled, then manufacturing is simpler, but heat insulation efficiency and mechanical resistance deteriorate
Solution Approach 1:
The patent applies parameter changes by specifying precise control parameters for pore size (0.1-10 μm) and porosity ratio (10-50%). These parameter ranges are optimized to achieve the best balance between heat insulation efficiency and mechanical properties. By defining specific parameter ranges rather than arbitrary values, the patent enables systematic manufacturing control that maintains both ease of production and high heat insulation performance.
3Ease of manufacture
If the porosity size is not controlled, then manufacturing is simpler, but mechanical resistance deteriorates
Solution Approach 1:
The patent applies parameter changes by establishing specific pore size ranges (0.1-10 μm) and porosity ratios (10-50%) that optimize both mechanical resistance and manufacturing feasibility. These parameter constraints provide clear manufacturing guidelines while ensuring the porous structure maintains adequate mechanical strength for belt operation.
4Temperature
If a porous structure is introduced, then heat insulation is improved, but thermal diffusion increases
Solution Approach 1:
The patent applies porous materials with carefully controlled pore sizes (0.1-10 μm) and porosity ratios (10-50%) to achieve heat insulation while minimizing thermal diffusion. The controlled pore structure creates thermal resistance through the numerous pore walls and interfaces, reducing both conductive and convective heat transfer. This resolves the contradiction by demonstrating that proper porous structure design can provide heat insulation benefits while limiting unwanted thermal diffusion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a material with improved mechanical strength and heat insulation properties, enabling high-speed and mass printing while reducing thermal diffusion, thus enhancing the efficiency and power-saving capabilities of the image fixing apparatus.
Implementation Method 1
a resin composition with an engineering plastic-based porous structure, where over 80% of the porosity consists of independent porosities with a mean size between 0.01 μm and 0.9 μm, and a porosity ratio within ±30% of the mean, is used to enhance mechanical and heat insulation properties
Data Source
AI summary
An object of the present invention is to provide a porous material (resin composition) having high heat insulation properties, mechanical properties, and electrical properties by controlling function of a porous film by setting a porosity size, distribution of the porosity size, and a porosity ratio of the porous film in predetermined ranges. The resin composition according to the present invention is comprised of an engineering plastic having porous structure in which not less than 80% of a total porosity is comprised of independent porosities, a mean porosity size is not less than 0.01 μm and not more than 0.9 μm, and not less than 80% of the total porosity has a porosity size within ±30% of the mean porosity size.