Porous Resin Shielding Layer for Moisture Vapor Discharge

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Solution Overview

Problem

In electronic circuit module components, moisture entering the insulating resin and substrate during production or storage can lead to increased internal pressure when heated, causing cracks and deformation due to the inability of existing metal shield layers to effectively discharge water vapor generated during the reflow process.

Innovation Solution

The implementation of a porous first resin in contact with electronic components, covered by a less porous second resin, with a metal layer that includes openings to expose the first resin, allowing for the discharge of moisture vapor and reducing internal pressure, while maintaining electromagnetic shielding functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal layer is formed as a shield layer on the entire surface of the insulating resin, then electromagnetic shielding is improved, but moisture vapor discharge is hindered causing internal pressure increase and potential cracks

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoidcrack resistance

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The metal layer is segmented by forming openings (through-holes) that divide the continuous metal shield into separate regions. This segmentation allows moisture vapor to pass through the metal layer via the openings while maintaining electromagnetic shielding in the metal-covered areas, thus resolving the contradiction between shielding effectiveness and vapor discharge capability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the insulating resin are treated differently: areas with electronic components receive full metal coverage for shielding, while areas with openings allow vapor discharge. The metal layer transitions from complete coverage to selective coverage, providing local quality optimization where shielding is applied where needed and vapor discharge is permitted where needed

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the insulating resin is completely sealed with metal layer, then electromagnetic shielding is enhanced, but moisture vapor discharge path is blocked leading to internal pressure buildup

Engineering Contradiction:

Improveelectromagnetic interference protectionVSAvoidinternal pressure

Core Design Contradiction:

Object-affected harmful factorsVSStress or pressure

Solution Approach 1:

The first insulating resin is made porous to provide moisture vapor discharge paths. The porous structure allows vapor to move through the resin toward the openings in the metal layer, preventing pressure buildup while maintaining the resin's protective and insulating functions

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The openings in the metal layer serve as intermediary channels that connect the internal resin environment to the external atmosphere. These openings mediate between the need for electromagnetic shielding (metal coverage) and the need for vapor discharge (open pathways), allowing vapor to escape through the metal layer without compromising overall shielding effectiveness

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces the risk of cracks and deformation by allowing moisture vapor to escape, while maintaining the electromagnetic shielding properties of the metal layer, thus ensuring the reliability and functionality of the electronic circuit module components.

Implementation Method 1

a first resin (4) that has pores and is in contact with at least a part of the electronic component (2)

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

a first resin (4) that has pores and is in contact with at least a part of the electronic component (2)

Methodology Applied

Scientific EffectDiffusion: Diffusion

Implementation Method 3

a metal layer (5) that covers the first resin (4) and the second resin (9) and is electrically connected to a ground (8) of the substrate (3)

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS8929089B2Electronic circuit module component and method of manufacturing electronic circuit module component

Publication Date: 2015.01.06 TDK CORP

AI summary

An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.