Porous Sample Support for Imaging Mass Spectrometry
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Solution Overview
Problem
In surface-assisted laser desorption/ionization methods, positional deviations of samples on substrates occur during ionization, making it difficult to maintain original position information and perform imaging mass spectrometry effectively.
Innovation Solution
A sample support with a substrate of 1 to 50 µm thickness and through-holes of 1 to 700 nm width is used, allowing samples to be raised via capillary phenomenon while maintaining positional information, and a conductive layer ensures efficient energy transmission for ionization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sample is dropped onto substrate for ionization, then ionization can be performed, but positional deviation occurs and original position information is lost
Solution Approach 1:
A transfer substrate is introduced as an intermediary between the sample and the analysis substrate. The sample is first transferred to the transfer substrate, then to the analysis substrate, ensuring precise positional information transfer throughout the process. This mediator enables both effective ionization and preservation of spatial distribution data.
Solution Approach 2:
The spatial distribution pattern of the sample is copied from the original sample location to the transfer substrate, and then to the analysis substrate. This copying process maintains the two-dimensional distribution information while enabling the sample to be positioned correctly for ionization analysis.
2Loss of information
If sample is transferred to substrate instead of dropping, then positional information may be maintained, but positional deviation or uneven transfer occurs
Solution Approach 1:
The mechanical transfer process is replaced with a capillary-driven transfer mechanism. The porous structure of the transfer substrate creates capillary forces that automatically draw the sample from the original location to the new location, eliminating mechanical positioning errors and ensuring uniform, precise transfer without deviation.
3Strength
If substrate thickness is increased for strength, then handling is improved, but capillary phenomenon effectiveness decreases
Solution Approach 1:
The substrate thickness parameter is optimized to a specific range (1-50 μm) that balances mechanical strength with capillary phenomenon effectiveness. Within this range, the substrate maintains sufficient strength for handling while remaining thin enough to allow effective capillary action for sample transfer. The porous structure parameters (pore size, porosity) are also adjusted to enhance capillary forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables ionization while preserving sample positional information, enhancing signal intensity and handling of the sample support, and facilitating imaging mass spectrometry.
Implementation Method 1
the sample can be raised from the other surface side toward the one surface side of the substrate via the through-holes using a capillary phenomenon
Implementation Method 2
when a laser beam is applied to the one surface of the substrate, energy thereof is transmitted to the sample moved to the one surface side via the conductive layer, and thereby the sample can be ionized
Implementation Method 3
surface-assisted laser desorption/ionization (SALDI) for ionizing a sample by using a substrate whose surface has an uneven microstructure
Implementation Method 4
ionizing a sample by mixing the sample with a low-molecular weight organic compound, called a matrix, absorbing an ultraviolet laser beam, and applying the laser beam to the mixture
Data Source
Figure 1(a)~1(c)
Figure 2
Figure 3
AI summary
A sample support (2) according to an aspect is a sample support for a surface-assisted laser desorption/ionization method, and includes: a substrate (21) in which a plurality of through-holes (S) passing from one surface (21a) thereof to the other surface (21b) thereof are provided; and a conductive layer (23) that is formed of a conductive material and covers at least the one surface (21a). The through-holes (S) have a width (d3) of 1 to 700 nm, and the substrate (21) has a thickness (d1) of 1 to 50 µm.