Porous Sealing Element for Hermetic Electronic Component Bonding
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Solution Overview
Problem
Existing methods for producing electronic components with hermetically sealed spaces are complex and costly, often requiring specialized equipment and chambers for vacuum or gas processing.
Innovation Solution
A procedure involving a porous and fluid-permeable sealing element between a flat component and cap, where a first bond is formed mechanically in air, followed by exposure to a gas atmosphere or vacuum, and a second bond seals the space by closing the pores of the sealing element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hermetic seal is created using traditional one-step soldering or two-step processes with vacuum chambers, then the sealing reliability is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The sealing process is divided into two distinct bonding steps: a first bonding step that creates mechanical connection without requiring vacuum, and a second bonding step that seals the gap hermetically. This segmentation allows each step to be optimized independently, with the first step using simple mechanical pressure and the second step applying heat to close pores and create hermetic seal.
Solution Approach 2:
A porous and fluid-permeable sealing element is introduced as an intermediary component between the component and cap. This sealing element enables the decoupling of mechanical bonding from hermetic sealing, allowing gas or vacuum to flow through its pores during the first bonding step while still providing the foundation for hermetic sealing in the second step.
2Manufacturing precision
If vacuum or gas processing is performed during initial bonding steps, then the sealing quality is improved, but the manufacturing time and cost increase
Solution Approach 1:
The mechanical bonding between component and cap is performed first in a preliminary action without requiring vacuum or gas processing. Only after this mechanical connection is established is the hermetic sealing performed in the second bonding step. This preliminary mechanical bonding eliminates the need for time-consuming vacuum processing during the initial alignment and bonding phase.
3Reliability
If specialized vacuum chambers and equipment are used for sealing, then the hermetic seal reliability is improved, but the manufacturing cost increases
Solution Approach 1:
The bonding process utilizes parameter changes, specifically temperature variation, to achieve different bonding objectives. The first bonding occurs at lower temperature or ambient conditions for mechanical connection, while the second bonding applies elevated temperature to close the pores of the sealing element and create hermetic seal. This parameter change eliminates the need for expensive vacuum chambers throughout the entire process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of electronic components with reliably sealed spaces in a simpler and more cost-effective manner, avoiding the need for extensive vacuum or gas processing during the initial bonding steps.
Implementation Method 1
fluid, in particular gas, flows through pores in the sealing element into the intermediate space
Implementation Method 2
a second bonding of the component and the cap takes place by applying a second bonding pressure and/or a second bonding temperature, whereby the pores of the sealing element are closed
Data Source
Figure 1(a)~1(d)
Figure 2(a)~2(d)
Figure 3(a)~3(d)
AI summary
The present application relates to a method for manufacturing an electronic component and an electronic component itself. In the proposed method for manufacturing an electronic component, a planar component (2) and a cap (2) are provided. Furthermore, a porous and fluid-permeable, in particular gas-permeable, sealing element (3) is arranged on the cap or on the component. The component and the cap are also arranged relative to each other such that the sealing element is positioned between the cap and the component and is in contact with both the cap and the component, and that a gap (5) between the cap and the component is at least partially bounded by the porous and fluid-permeable sealing element.In a further step, the component and the cap are first bonded by applying an initial bonding pressure and/or a first bonding temperature such that a mechanically durable connection between the component and the cap is created. In a further step, for example after the first bonding, the cap and the component are exposed to a fluid, in particular a gas atmosphere, or to a vacuum, whereby the fluid, in particular gas, flows through pores of the sealing element into or escapes from the gap. During or subsequently, a second bonding of the component and the cap is carried out by applying a second bonding pressure and/or a second bonding temperature, thereby closing the pores of the sealing element and sealing the gap.